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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    110-87-952-41-001101

    110-87-952-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-952-41-001101

    Tabla de datos

    110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-632-41-105101

    110-83-632-41-105101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-632-41-105101

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    121-83-424-41-001101

    121-83-424-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    121-83-424-41-001101

    Tabla de datos

    121 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    38-1518-10

    38-1518-10

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    0
    RFQ
    38-1518-10

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-820-90C

    04-820-90C

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    0
    RFQ
    04-820-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-822-90C

    04-822-90C

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    0
    RFQ
    04-822-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-823-90C

    04-823-90C

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    0
    RFQ
    04-823-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-87-089-13-082101

    510-87-089-13-082101

    CONN SOCKET PGA 89POS GOLD

    Preci-Dip

    0
    RFQ
    510-87-089-13-082101

    Tabla de datos

    510 Bulk Active PGA 89 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-318-41-011101

    116-83-318-41-011101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-318-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    25-0518-10T

    25-0518-10T

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    0
    RFQ
    25-0518-10T

    Tabla de datos

    518 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    410-93-220-10-001000

    410-93-220-10-001000

    CONN ZIG-ZAG 20POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    410-93-220-10-001000

    Tabla de datos

    410 Tube Active Zig-Zag, Left Stackable 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-87-610-10-002101

    299-87-610-10-002101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    299-87-610-10-002101

    Tabla de datos

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PLCC-028-T-N

    PLCC-028-T-N

    CONN SOCKET PLCC 28POS TIN

    Samtec Inc.

    0
    RFQ
    PLCC-028-T-N

    Tabla de datos

    PLCC Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-314-TL-I

    ICF-314-TL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    0
    RFQ
    ICF-314-TL-I

    Tabla de datos

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-87-328-41-007101

    116-87-328-41-007101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-328-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-83-628-41-001101

    612-83-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    612-83-628-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-4513-11H

    10-4513-11H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    0
    RFQ
    10-4513-11H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-6513-11

    16-6513-11

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-6513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-1518-10H

    32-1518-10H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    0
    RFQ
    32-1518-10H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    35-0518-10T

    35-0518-10T

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    0
    RFQ
    35-0518-10T

    Tabla de datos

    518 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 214215216217218219220221...955Next»
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