Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    110-87-952-41-001101

    110-87-952-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    2,125
    RFQ
    110-87-952-41-001101

    Tabla de datos

    110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-632-41-105101

    110-83-632-41-105101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,571
    RFQ
    110-83-632-41-105101

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    121-83-424-41-001101

    121-83-424-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,477
    RFQ
    121-83-424-41-001101

    Tabla de datos

    121 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    38-1518-10

    38-1518-10

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    2,676
    RFQ
    38-1518-10

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-820-90C

    04-820-90C

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    3,948
    RFQ
    04-820-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-822-90C

    04-822-90C

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    3,712
    RFQ
    04-822-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-823-90C

    04-823-90C

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    4,717
    RFQ
    04-823-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-87-089-13-082101

    510-87-089-13-082101

    CONN SOCKET PGA 89POS GOLD

    Preci-Dip

    4,447
    RFQ
    510-87-089-13-082101

    Tabla de datos

    510 Bulk Active PGA 89 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-318-41-011101

    116-83-318-41-011101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,082
    RFQ
    116-83-318-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    25-0518-10T

    25-0518-10T

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    3,072
    RFQ
    25-0518-10T

    Tabla de datos

    518 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    410-93-220-10-001000

    410-93-220-10-001000

    CONN ZIG-ZAG 20POS GOLD

    Mill-Max Manufacturing Corp.

    4,114
    RFQ
    410-93-220-10-001000

    Tabla de datos

    410 Tube Active Zig-Zag, Left Stackable 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-87-610-10-002101

    299-87-610-10-002101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,350
    RFQ
    299-87-610-10-002101

    Tabla de datos

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PLCC-028-T-N

    PLCC-028-T-N

    CONN SOCKET PLCC 28POS TIN

    Samtec Inc.

    2,412
    RFQ
    PLCC-028-T-N

    Tabla de datos

    PLCC Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-314-TL-I

    ICF-314-TL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,012
    RFQ
    ICF-314-TL-I

    Tabla de datos

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-87-328-41-007101

    116-87-328-41-007101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,822
    RFQ
    116-87-328-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-83-628-41-001101

    612-83-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,075
    RFQ
    612-83-628-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-4513-11H

    10-4513-11H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,908
    RFQ
    10-4513-11H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-6513-11

    16-6513-11

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,312
    RFQ
    16-6513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-1518-10H

    32-1518-10H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,838
    RFQ
    32-1518-10H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    35-0518-10T

    35-0518-10T

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    3,252
    RFQ
    35-0518-10T

    Tabla de datos

    518 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 214215216217218219220221...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios