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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    614-87-640-41-001101

    614-87-640-41-001101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    0
    RFQ
    614-87-640-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0120-TT-2

    HLS-0120-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0120-TT-2

    Tabla de datos

    HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    34-0518-10T

    34-0518-10T

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    0
    RFQ
    34-0518-10T

    Tabla de datos

    518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-0517-90C

    10-0517-90C

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    0
    RFQ
    10-0517-90C

    Tabla de datos

    0517 Bulk Active SIP 10 (1 x 10) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-424-41-009101

    116-87-424-41-009101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-424-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-322-41-008101

    116-83-322-41-008101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-322-41-008101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-640-41-005101

    117-83-640-41-005101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    0
    RFQ
    117-83-640-41-005101

    Tabla de datos

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-322-41-035101

    146-83-322-41-035101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    146-83-322-41-035101

    Tabla de datos

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-322-41-036101

    146-83-322-41-036101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    146-83-322-41-036101

    Tabla de datos

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-422-41-035101

    146-83-422-41-035101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    146-83-422-41-035101

    Tabla de datos

    146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-422-41-036101

    146-83-422-41-036101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    146-83-422-41-036101

    Tabla de datos

    146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0105-G-32

    HLS-0105-G-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0105-G-32

    Tabla de datos

    HLS Tube Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-87-642-41-105161

    110-87-642-41-105161

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-642-41-105161

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    214-99-306-01-670799

    214-99-306-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    214-44-306-01-670799

    214-44-306-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    21-0513-10T

    21-0513-10T

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    0
    RFQ
    21-0513-10T

    Tabla de datos

    0513 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    23-0518-10H

    23-0518-10H

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    0
    RFQ
    23-0518-10H

    Tabla de datos

    518 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    121-83-624-41-001101

    121-83-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    121-83-624-41-001101

    Tabla de datos

    121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-628-41-002101

    116-87-628-41-002101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-628-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-320-LTT

    ICO-320-LTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-320-LTT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 212213214215216217218219...955Next»
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