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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    110-87-650-41-005101

    110-87-650-41-005101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,095
    RFQ
    110-87-650-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-308-TM-I-TR

    ICF-308-TM-I-TR

    .100" SMT SCREW MACHINE DIP SOCK

    Samtec Inc.

    3,848
    RFQ
    ICF-308-TM-I-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    115-83-328-41-003101

    115-83-328-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,954
    RFQ
    115-83-328-41-003101

    Tabla de datos

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    121-83-318-41-001101

    121-83-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,225
    RFQ
    121-83-318-41-001101

    Tabla de datos

    121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    299-87-608-10-002101

    299-87-608-10-002101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,267
    RFQ
    299-87-608-10-002101

    Tabla de datos

    299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0205-TT-12

    HLS-0205-TT-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,659
    RFQ
    HLS-0205-TT-12

    Tabla de datos

    HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    540-44-068-17-400000

    540-44-068-17-400000

    CONN SOCKET PLCC 68POS TIN

    Mill-Max Manufacturing Corp.

    2,489
    RFQ
    540-44-068-17-400000

    Tabla de datos

    540 Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    20-3513-10

    20-3513-10

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,474
    RFQ
    20-3513-10

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    117-83-430-41-005101

    117-83-430-41-005101

    CONN IC DIP SOCKET 30POS GOLD

    Preci-Dip

    2,904
    RFQ
    117-83-430-41-005101

    Tabla de datos

    117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2-1437537-1

    2-1437537-1

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    2,095
    RFQ
    2-1437537-1

    Tabla de datos

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    116-83-422-41-006101

    116-83-422-41-006101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,766
    RFQ
    116-83-422-41-006101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4-1571551-5

    4-1571551-5

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    2,544
    RFQ
    4-1571551-5

    Tabla de datos

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    300-032-050

    300-032-050

    CONN SOCKET SIP 32POS GOLD

    3M

    2,423
    RFQ

    -

    300 Box Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    116-87-322-41-002101

    116-87-322-41-002101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,482
    RFQ
    116-87-322-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-624-41-001101

    614-83-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,141
    RFQ
    614-83-624-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    C9314-02

    C9314-02

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,261
    RFQ
    C9314-02

    Tabla de datos

    Lo-PRO®file, C93 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    08-6513-10H

    08-6513-10H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,881
    RFQ
    08-6513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3518-11

    14-3518-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,620
    RFQ
    14-3518-11

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-320-41-105191

    110-83-320-41-105191

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,460
    RFQ

    -

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-87-324-41-001101

    123-87-324-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,438
    RFQ
    123-87-324-41-001101

    Tabla de datos

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 179180181182183184185186...955Next»
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