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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-83-322-41-006101

    116-83-322-41-006101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,269
    RFQ
    116-83-322-41-006101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4-1571551-6

    4-1571551-6

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    3,148
    RFQ
    4-1571551-6

    Tabla de datos

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0302-T-10

    HLS-0302-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,933
    RFQ
    HLS-0302-T-10

    Tabla de datos

    HLS Tube Active SIP 6 (3 x 2) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-83-420-41-105101

    110-83-420-41-105101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,221
    RFQ
    110-83-420-41-105101

    Tabla de datos

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-328-41-003101

    116-87-328-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,309
    RFQ
    116-87-328-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-3518-11H

    06-3518-11H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,881
    RFQ
    06-3518-11H

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-6513-10T

    16-6513-10T

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,473
    RFQ
    16-6513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-1518-11

    18-1518-11

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,727
    RFQ
    18-1518-11

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-0518-10T

    24-0518-10T

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    3,214
    RFQ
    24-0518-10T

    Tabla de datos

    518 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-1518-10T

    24-1518-10T

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,888
    RFQ
    24-1518-10T

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-6513-10T

    12-6513-10T

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    2,799
    RFQ
    12-6513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-0518-11

    15-0518-11

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    3,333
    RFQ
    15-0518-11

    Tabla de datos

    518 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-0518-10

    22-0518-10

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    3,269
    RFQ
    22-0518-10

    Tabla de datos

    518 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-314-41-001101

    116-83-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,343
    RFQ
    116-83-314-41-001101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR40-HZW/T

    AR40-HZW/T

    CONN IC DIP SOCKET 40POS GOLD

    Assmann WSW Components

    3,908
    RFQ
    AR40-HZW/T

    Tabla de datos

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    540-88-068-17-400-2

    540-88-068-17-400-2

    CONN SOCKET PLCC 68POS TIN

    Preci-Dip

    4,513
    RFQ
    540-88-068-17-400-2

    Tabla de datos

    540 Bulk Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin - Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
    346-43-106-41-013000

    346-43-106-41-013000

    CONN SOCKET SIP 6POS GOLD

    Mill-Max Manufacturing Corp.

    2,838
    RFQ
    346-43-106-41-013000

    Tabla de datos

    346 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-87-318-41-001101

    116-87-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,653
    RFQ
    116-87-318-41-001101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    12-6513-10

    12-6513-10

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,751
    RFQ
    12-6513-10

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-87-320-41-007101

    116-87-320-41-007101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,796
    RFQ
    116-87-320-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 175176177178179180181182...955Next»
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