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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    14-0518-10T

    14-0518-10T

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    2,397
    RFQ
    14-0518-10T

    Tabla de datos

    518 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-1518-10T

    14-1518-10T

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,236
    RFQ
    14-1518-10T

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-318-41-018101

    116-87-318-41-018101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,987
    RFQ
    116-87-318-41-018101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-312-41-009101

    116-87-312-41-009101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    2,229
    RFQ
    116-87-312-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-308-41-134191

    114-87-308-41-134191

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    3,184
    RFQ
    114-87-308-41-134191

    Tabla de datos

    114 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SMPX-52LCC-N

    SMPX-52LCC-N

    SMT PLCC SOCKET 52P NON POLARISE

    Kycon, Inc.

    4,234
    RFQ
    SMPX-52LCC-N

    Tabla de datos

    SMPX Tube Active PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
    SIP050-1X19-157B

    SIP050-1X19-157B

    1X19-157B-SIP SOCKET 19 CTS

    Amphenol ICC (FCI)

    3,616
    RFQ
    SIP050-1X19-157B

    Tabla de datos

    SIP050-1x Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    116-83-210-41-002101

    116-83-210-41-002101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,378
    RFQ
    116-83-210-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-310-41-002101

    116-83-310-41-002101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,044
    RFQ
    116-83-310-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-420-41-001101

    110-83-420-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,083
    RFQ
    110-83-420-41-001101

    Tabla de datos

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    124-83-308-41-002101

    124-83-308-41-002101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    2,285
    RFQ

    -

    124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-624-41-003101

    115-87-624-41-003101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,178
    RFQ
    115-87-624-41-003101

    Tabla de datos

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-87-316-41-105101

    117-87-316-41-105101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    4,034
    RFQ
    117-87-316-41-105101

    Tabla de datos

    117 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-0513-10H

    08-0513-10H

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    2,635
    RFQ
    08-0513-10H

    Tabla de datos

    0513 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-1518-10

    16-1518-10

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,076
    RFQ
    16-1518-10

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-1518-11

    08-1518-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,473
    RFQ
    08-1518-11

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-310-41-011101

    116-87-310-41-011101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,138
    RFQ
    116-87-310-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0203-TT-12

    HLS-0203-TT-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,272
    RFQ
    HLS-0203-TT-12

    Tabla de datos

    HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    115-83-318-41-001101

    115-83-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,947
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-610-41-007101

    116-83-610-41-007101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,916
    RFQ
    116-83-610-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 134135136137138139140141...955Next»
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