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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    110-83-318-41-605101

    110-83-318-41-605101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    3,960
    RFQ
    110-83-318-41-605101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    121-83-310-41-001101

    121-83-310-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,995
    RFQ
    121-83-310-41-001101

    Tabla de datos

    121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    130-024-050

    130-024-050

    CONN IC DIP SOCKET 24POS GOLD

    3M

    2,095
    RFQ
    130-024-050

    Tabla de datos

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    110-83-320-41-001151

    110-83-320-41-001151

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    2,491
    RFQ

    -

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-314-41-134191

    114-83-314-41-134191

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,170
    RFQ
    114-83-314-41-134191

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    05-0513-11

    05-0513-11

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    2,376
    RFQ
    05-0513-11

    Tabla de datos

    0513 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    SIP050-1X16-160B

    SIP050-1X16-160B

    1X16-160B-SIP SOCKET 16 CTS

    Amphenol ICC (FCI)

    3,370
    RFQ
    SIP050-1X16-160B

    Tabla de datos

    SIP050-1x Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    917-87-108-41-053101

    917-87-108-41-053101

    CONN TRANSIST TO-5 8POS GOLD

    Preci-Dip

    4,724
    RFQ
    917-87-108-41-053101

    Tabla de datos

    917 Bulk Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    917-87-208-41-053101

    917-87-208-41-053101

    CONN TRANSIST TO-5 8POS GOLD

    Preci-Dip

    2,507
    RFQ
    917-87-208-41-053101

    Tabla de datos

    917 Bulk Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 64-HGL-TT

    AR 64-HGL-TT

    SOCKET

    Assmann WSW Components

    2,363
    RFQ

    -

    AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    814-AG11D-ES

    814-AG11D-ES

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    2,298
    RFQ
    814-AG11D-ES

    Tabla de datos

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
    410-83-216-10-001101

    410-83-216-10-001101

    CONN ZIG-ZAG 16POS GOLD

    Preci-Dip

    2,401
    RFQ
    410-83-216-10-001101

    Tabla de datos

    410 Bulk Active Zig-Zag, Left Stackable 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    410-83-216-10-002101

    410-83-216-10-002101

    CONN ZIG-ZAG 16POS GOLD

    Preci-Dip

    3,109
    RFQ
    410-83-216-10-002101

    Tabla de datos

    410 Bulk Active Zig-Zag, Right Stackable 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    11-0513-10

    11-0513-10

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    3,344
    RFQ
    11-0513-10

    Tabla de datos

    0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-0513-10T

    12-0513-10T

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    2,393
    RFQ
    12-0513-10T

    Tabla de datos

    0513 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0503-21

    02-0503-21

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    2,932
    RFQ
    02-0503-21

    Tabla de datos

    0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    02-0503-31

    02-0503-31

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    2,481
    RFQ
    02-0503-31

    Tabla de datos

    0503 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    06-0518-11H

    06-0518-11H

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    4,613
    RFQ
    06-0518-11H

    Tabla de datos

    518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-1518-11H

    06-1518-11H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,618
    RFQ
    06-1518-11H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    13-0518-10H

    13-0518-10H

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    4,250
    RFQ
    13-0518-10H

    Tabla de datos

    518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 133134135136137138139140...955Next»
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