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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    12-0518-10T

    12-0518-10T

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    2,154
    RFQ
    12-0518-10T

    Tabla de datos

    518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-1518-10T

    12-1518-10T

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,032
    RFQ
    12-1518-10T

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    612-83-312-41-001101

    612-83-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    3,696
    RFQ
    612-83-312-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-020-05-001101

    510-83-020-05-001101

    CONN SOCKET PGA 20POS GOLD

    Preci-Dip

    4,385
    RFQ
    510-83-020-05-001101

    Tabla de datos

    510 Bulk Active PGA 20 (5 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-318-41-134191

    114-87-318-41-134191

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,833
    RFQ
    114-87-318-41-134191

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS 028-Z-SM/T

    A-CCS 028-Z-SM/T

    IC SOCKET, CHIP CARRIER, 1.27MM,

    Assmann WSW Components

    2,014
    RFQ
    A-CCS 028-Z-SM/T

    Tabla de datos

    - Tape & Reel (TR) Active PLCC 28 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
    2-640358-2

    2-640358-2

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    2,571
    RFQ
    2-640358-2

    Tabla de datos

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    110-87-316-41-105101

    110-87-316-41-105101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    4,812
    RFQ
    110-87-316-41-105101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR28-HZL/01-TT

    AR28-HZL/01-TT

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    2,344
    RFQ
    AR28-HZL/01-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    114-87-322-41-117101

    114-87-322-41-117101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,290
    RFQ
    114-87-322-41-117101

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    04-0513-11H

    04-0513-11H

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    3,415
    RFQ
    04-0513-11H

    Tabla de datos

    0513 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-87-318-41-001101

    614-87-318-41-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,204
    RFQ
    614-87-318-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X14-160B

    SIP050-1X14-160B

    1X14-160B-SIP SOCKET 14 CTS

    Amphenol ICC (FCI)

    4,776
    RFQ
    SIP050-1X14-160B

    Tabla de datos

    SIP050-1x Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    643642-2

    643642-2

    CONN SOCKET SIP 10POS GOLD

    TE Connectivity AMP Connectors

    3,267
    RFQ
    643642-2

    Tabla de datos

    Diplomate DL Tray Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    614-83-210-41-001101

    614-83-210-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    3,006
    RFQ
    614-83-210-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    410-83-214-10-001101

    410-83-214-10-001101

    CONN ZIG-ZAG 14POS GOLD

    Preci-Dip

    3,232
    RFQ
    410-83-214-10-001101

    Tabla de datos

    410 Bulk Active Zig-Zag 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    410-83-214-10-002101

    410-83-214-10-002101

    CONN ZIG-ZAG 14POS GOLD

    Preci-Dip

    2,140
    RFQ
    410-83-214-10-002101

    Tabla de datos

    410 Bulk Active Zig-Zag 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    DIP640-014B

    DIP640-014B

    DIP640-014B-DIP SOCKET 40 CTS

    Amphenol ICC (FCI)

    2,004
    RFQ
    DIP640-014B

    Tabla de datos

    - Bag Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    814-AG11D-ESL

    814-AG11D-ESL

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    4,604
    RFQ
    814-AG11D-ESL

    Tabla de datos

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
    1814640-6

    1814640-6

    CONN IC DIP SOCKET 6POS GOLD

    TE Connectivity AMP Connectors

    3,004
    RFQ
    1814640-6

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Thermoplastic, Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 125126127128129130131132...955Next»
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