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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    05-0518-11H

    05-0518-11H

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    4,341
    RFQ
    05-0518-11H

    Tabla de datos

    518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    13-0518-10

    13-0518-10

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    2,204
    RFQ
    13-0518-10

    Tabla de datos

    518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    03-0508-30

    03-0508-30

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    4,999
    RFQ
    03-0508-30

    Tabla de datos

    508 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    SIP1X27-014B

    SIP1X27-014B

    SIP1X27-014B-SIP SOCKET 27 CTS

    Amphenol ICC (FCI)

    4,382
    RFQ
    SIP1X27-014B

    Tabla de datos

    SIP1x Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    116-87-610-41-007101

    116-87-610-41-007101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    4,911
    RFQ
    116-87-610-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-312-41-105101

    110-83-312-41-105101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    3,407
    RFQ
    110-83-312-41-105101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-324-41-605101

    110-87-324-41-605101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,304
    RFQ
    110-87-324-41-605101

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-324-41-005101

    110-87-324-41-005101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,298
    RFQ
    110-87-324-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0102-G-12

    HLS-0102-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,578
    RFQ
    HLS-0102-G-12

    Tabla de datos

    HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ARO 64-HZL/NEC-T

    ARO 64-HZL/NEC-T

    SOCKET

    Assmann WSW Components

    2,994
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    540-99-032-24-000000

    540-99-032-24-000000

    CONN SOCKET PLCC 32POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    2,240
    RFQ
    540-99-032-24-000000

    Tabla de datos

    540 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    AR24-HZL/7/07-TT

    AR24-HZL/7/07-TT

    CONN IC DIP SOCKET 24POS GOLD

    Assmann WSW Components

    3,217
    RFQ

    -

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    ED044PLCZ

    ED044PLCZ

    CONN SOCKET PLCC 44POS TIN

    On Shore Technology Inc.

    4,366
    RFQ
    ED044PLCZ

    Tabla de datos

    ED Tube Active PLCC 44 (2 x 22) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
    A-ICS-254-08-TT50

    A-ICS-254-08-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    4,176
    RFQ
    A-ICS-254-08-TT50

    Tabla de datos

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    D2614-42

    D2614-42

    CONN IC DIP SOCKET 14POS GOLD

    Harwin Inc.

    2,782
    RFQ
    D2614-42

    Tabla de datos

    D26 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 32 HGL-TT

    AR 32 HGL-TT

    SOCKET

    Assmann WSW Components

    2,383
    RFQ

    -

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    116-83-308-41-009101

    116-83-308-41-009101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    4,571
    RFQ
    116-83-308-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-2513-10T

    10-2513-10T

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,704
    RFQ
    10-2513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-0518-11

    09-0518-11

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    4,805
    RFQ
    09-0518-11

    Tabla de datos

    518 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0518-10H

    11-0518-10H

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    4,914
    RFQ
    11-0518-10H

    Tabla de datos

    518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 124125126127128129130131...955Next»
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