Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Paquete/Caja | Embalaje | Estado del producto | Aplicaciones | Corriente - Suministro | Voltaje - Suministro | Temperatura de funcionamiento | Grado | Calificación | Tipo de montaje | Proveedor Dispositivo Paquete |
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MC32PF3001A2EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
0 |
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![]() Tabla de datos |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 48-HVQFN (7x7) |
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MC32PF3001A4EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
0 |
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![]() Tabla de datos |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 48-HVQFN (7x7) |
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MC32PF3001A5EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
0 |
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![]() Tabla de datos |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 48-HVQFN (7x7) |
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MFS2325BMBA0EPMFS2325BMBA0EP NXP USA Inc. |
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![]() Tabla de datos |
- | 48-VFQFN Exposed Pad | Bulk | Active | System Basis Chip | - | 3.3V, 5V | -40°C ~ 120°C | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MPF5024AMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc. |
0 |
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- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MPF5024AVNA0ESR2PF5024 NXP USA Inc. |
0 |
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- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MPF5032BMMA0ESR2PMIC 2 BUCKS 2 LDO A1 DIE NXP USA Inc. |
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- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MPF5032BMMA5ESR2PMIC 2 BUCKS 2 LDO A1 DIE NXP USA Inc. |
0 |
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![]() Tabla de datos |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MPF5023CVNA0ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
0 |
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![]() Tabla de datos |
- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MPF5023CMMA0ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
0 |
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![]() Tabla de datos |
- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |