Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Paquete/Caja | Embalaje | Estado del producto | Aplicaciones | Corriente - Suministro | Voltaje - Suministro | Temperatura de funcionamiento | Grado | Calificación | Tipo de montaje | Proveedor Dispositivo Paquete |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MFS2323BMBB7EPMFS2323BMBB7EP NXP USA Inc. |
0 |
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- | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MFS8620BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
0 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) |
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MFS8621BMBA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
0 |
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- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MC33813AEIC CTRL SMALL ENG 1CYL 48LQFP NXP USA Inc. |
0 |
|
- |
- | 48-LQFP Exposed Pad | Tray | Active | Small Engine | 10mA | 4.5V ~ 36V | -40°C ~ 125°C | - | - | Surface Mount | 48-LQFP-EP (7x7) |
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MC33FS4505NAER2SYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
0 |
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- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MPF5020CVNA0ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
0 |
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- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | - | - | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MPF5020CMMA0ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
0 |
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- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | - | - | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MPF5020AMBA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
0 |
|
- |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Microcontroller, MCU | 40µA | 2.7V ~ 5.5V | -40°C ~ 150°C (TJ) | - | - | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MPF5020CMBA0ESR2POWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
0 |
|
![]() Tabla de datos |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | - | - | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MC34PF3001A1EPR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
0 |
|
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- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount | 48-HVQFN (7x7) |