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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Disipadores de calor

    制造商 Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del 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    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Paquete refrigerado Método de fijación Forma Longitud Ancho Diámetro Altura de la aleta Disipación de energía a aumento de temperatura Resistencia térmica a flujo de aire forzado Resistencia térmica a natural Material Acabado del material
    2283B

    2283B

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    2283B

    Tabla de datos

    - Bulk Active Board Level BGA Thermal Tape, Adhesive (Not Included) Square, Fins 0.655" (16.64mm) 0.655" (16.64mm) - 0.265" (6.73mm) 1.0W @ 40°C 17.50°C/W @ 300 LFM - Aluminum Black Anodized
    373024B00032G

    373024B00032G

    BGA HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ

    -

    - Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) - - - - 0.350" (8.89mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 33.30°C/W Aluminum Black Anodized
    373024B00034G

    373024B00034G

    BGA HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ

    -

    - Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) - - - - 0.350" (8.89mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 33.30°C/W Aluminum Black Anodized
    580100W00000G

    580100W00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    580100W00000G

    Tabla de datos

    - Bulk Active Top Mount 8-DIP Press Fit, Slide On Rectangular, Fins 0.562" (14.27mm) 0.600" (15.24mm) - 0.450" (11.43mm) 1.0W @ 30°C 8.00°C/W @ 500 LFM 30.00°C/W Aluminum Black Anodized
    374824B00035G

    374824B00035G

    BGA HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    374824B00035G

    Tabla de datos

    - Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) - - - - 0.984" (25.00mm) 2.0W @ 30°C 5.00°C/W @ 200 LFM 12.00°C/W Aluminum Black Anodized
    6400B-P2G

    6400B-P2G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    6400B-P2G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.500" (63.50mm) 1.650" (41.91mm) - 1.000" (25.40mm) 4.0W @ 20°C 1.50°C/W @ 400 LFM 2.70°C/W Aluminum Black Anodized
    533302B02551G

    533302B02551G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    533302B02551G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 2.500" (63.50mm) 1.375" (34.93mm) - 0.500" (12.70mm) 8.0W @ 60°C 2.00°C/W @ 800 LFM 8.00°C/W Aluminum Black Anodized
    529701B02100G

    529701B02100G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    529701B02100G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.50°C/W Aluminum Black Anodized
    501000B00000G

    501000B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    501000B00000G

    Tabla de datos

    - Bulk Active Top Mount 14-DIP and 16-DIP Thermal Tape, Adhesive (Not Included) Rectangular, Fins 0.750" (19.05mm) 0.604" (15.34mm) - 0.212" (5.39mm) 0.6W @ 40°C 60.00°C/W @ 100 LFM 60.00°C/W Aluminum Black Anodized
    335214B00032G

    335214B00032G

    BGA HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    335214B00032G

    Tabla de datos

    - Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.390" (9.91mm) - 5.30°C/W @ 200 LFM 10.00°C/W Aluminum Black Anodized
    550402B00000

    550402B00000

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    550402B00000

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular 1.675" (42.55mm) 1.000" (25.40mm) - 1.000" (25.40mm) 4.0W @ 40°C 4.00°C/W @ 300 LFM 11.20°C/W Aluminum Black Anodized
    591202B03700G

    591202B03700G

    HEATSINK TO-220 CLIP-ON BLACK

    Boyd Laconia, LLC

    0
    RFQ
    591202B03700G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 40°C 16.00°C/W @ 200 LFM 26.80°C/W Aluminum Black Anodized
    2262R

    2262R

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    2262R

    Tabla de datos

    - Bulk Active Top Mount TO-5 Bolt On Cylindrical - - 0.318" (8.07mm) ID, 0.602" (15.29mm) OD 0.250" (6.35mm) 1.6W @ 80°C 30.00°C/W @ 200 LFM - Aluminum Red Anodized
    519703B00000G

    519703B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    519703B00000G

    Tabla de datos

    - Bulk Active Board Level TO-3 Bolt On Rhombus 1.550" (39.37mm) 1.550" (39.37mm) - 1.500" (38.10mm) 6.0W @ 30°C 2.00°C/W @ 400 LFM 4.80°C/W Aluminum Black Anodized
    575400B00000G

    575400B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    575400B00000G

    Tabla de datos

    - Bulk Active Top Mount TO-92 Press Fit Rectangular, Fins 0.602" (15.29mm) - - 1.220" (31.00mm) 0.5W @ 20°C 20.00°C/W @ 200 LFM 40.00°C/W Aluminum Black Anodized
    575502B00000G

    575502B00000G

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    575502B00000G

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.250" (6.35mm) 1.5W @ 40°C 6.00°C/W @ 400 LFM 24.00°C/W Aluminum Black Anodized
    374524B00032G

    374524B00032G

    BGA HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ

    -

    - Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) - - - - 0.984" (25.00mm) 4.0W @ 70°C 4.00°C/W @ 400 LFM 16.50°C/W Aluminum Black Anodized
    529801B00000

    529801B00000

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    529801B00000

    Tabla de datos

    - Bulk Active Board Level TO-218 Bolt On Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) 5.0W @ 30°C 3.00°C/W @ 200 LFM 5.00°C/W Aluminum Black Anodized
    513002B00000

    513002B00000

    BOARD LEVEL HEAT SINK

    Boyd Laconia, LLC

    0
    RFQ
    513002B00000

    Tabla de datos

    - Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
    550102B00000

    550102B00000

    HEATSINK TO-220 TAB BLACK

    Boyd Laconia, LLC

    0
    RFQ
    550102B00000

    Tabla de datos

    - Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.675" (42.55mm) 1.000" (25.40mm) - 1.000" (25.40mm) 1.5W @ 20°C 4.00°C/W @ 300 LFM 12.40°C/W Aluminum Black Anodized
    Total 122183 Record«Prev1... 60766077607860796080608160826083...6110Next»
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