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| Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo | Composición | Diámetro | Punto de fusión | Tipo de fundente | Calibre del cable | Tipo de malla | Proceso | Forma | Vida útil | Inicio de vida útil | Temperatura de almacenamiento/refrigeración |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NC191AX15SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
20 |
|
Tabla de datos |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191LTA15SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
18 |
|
Tabla de datos |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 4 | - | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191LT15SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
15 |
|
Tabla de datos |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
RASWLF.031 2OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
37 |
|
Tabla de datos |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 2 oz (56.70g) | 60 Months | Date of Manufacture | - |
|
SMDSWLF.031 1OZSLD WIRE NO-CLEAN 96.5/3/.5 1OZ. Chip Quik Inc. |
38 |
|
Tabla de datos |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 oz (28.35g) | - | - | - |
|
SMDSWLF.015 1OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
18 |
|
Tabla de datos |
SMD | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 1 oz (28.35g) | - | - | - |
|
SMD2SWLF.031 1OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
8 |
|
Tabla de datos |
SMD2 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 1 oz (28.35g) | - | - | - |
|
RASWLF.020 2OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
12 |
|
Tabla de datos |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 2 oz (56.70g) | 60 Months | Date of Manufacture | - |
|
RASWLF.015 2OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
11 |
|
Tabla de datos |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 2 oz (56.70g) | - | - | - |
|
NC191SNL15SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
36 |
|
Tabla de datos |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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