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| Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo | Composición | Diámetro | Punto de fusión | Tipo de fundente | Calibre del cable | Tipo de malla | Proceso | Forma | Vida útil | Inicio de vida útil | Temperatura de almacenamiento/refrigeración |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDSWLF.015 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
4 |
|
Tabla de datos |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
RASWLF.015 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3 |
|
Tabla de datos |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMD2170SOLDER SPHERES SN63/PB37 .014" ( Chip Quik Inc. |
2 |
|
Tabla de datos |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.014" (0.36mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
TS991SNL500T3SOLDER PASTE THERMALLY STABLE NC Chip Quik Inc. |
3 |
|
Tabla de datos |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture | - |
|
WS991AX500T4SOLDER PASTE THERMALLY STABLE WS Chip Quik Inc. |
3 |
|
Tabla de datos |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - |
|
SMD2150SOLDER SPHERES SN63/PB37 .010" ( Chip Quik Inc. |
9 |
|
Tabla de datos |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.010" (0.25mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
SMDSWLF.059 3.3 1LBSOLDER WIRE SN96.5/AG3.0/CU0.5 Chip Quik Inc. |
6 |
|
Tabla de datos |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.059" (1.50mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 1 lb (453.59g) | - | - | - |
|
WS991LT500T4SOLDER PASTE THERMALLY STABLE WS Chip Quik Inc. |
5 |
|
Tabla de datos |
CHIPQUIK® | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | Water Soluble | - | 4 | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | - |
|
SMD4300LTLFP250T4SOLDER PASTE SN42/BI57.6/AG0.4 Chip Quik Inc. |
4 |
|
Tabla de datos |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean, Water Soluble | - | - | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 32°F ~ 77°F (0°C ~ 25°C) |
|
SMD3SWLT.040 100GSN42/BI58 2.2% FLUX CORE SOLDER Chip Quik Inc. |
2 |
|
Tabla de datos |
SMD3 | Bulk | Active | Wire Solder | Bi58Sn42 (58/42) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - |
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- Simple y profesional Soluciones de adquisición electrónica integral.
