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    制造商 Serie Embalaje Estado del producto Tipo Composición Diámetro Punto de fusión Tipo de fundente Calibre del cable Tipo de malla Proceso Forma Vida útil Inicio de vida útil Temperatura de almacenamiento/refrigeración





















































































































































































































































































































































































































































































































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    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Composición Diámetro Punto de fusión Tipo de fundente Calibre del cable Tipo de malla Proceso Forma Vida útil Inicio de vida útil Temperatura de almacenamiento/refrigeración
    SMD291SNL250T4

    SMD291SNL250T4

    SLDR PST NO-CLEAN SAC305 T4 250G

    Chip Quik Inc.

    13
    RFQ
    SMD291SNL250T4

    Tabla de datos

    - Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMD4300SNL250T4

    SMD4300SNL250T4

    SLDR PST WATR SOL SAC305 T4 250G

    Chip Quik Inc.

    6
    RFQ
    SMD4300SNL250T4

    Tabla de datos

    CHIPQUIK® SMD4300 Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    TS391SNL250

    TS391SNL250

    THERMALLY STABLE SOLDER PASTE NO

    Chip Quik Inc.

    12
    RFQ
    TS391SNL250

    Tabla de datos

    - Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
    SMDLTLFP250T3

    SMDLTLFP250T3

    SOLDER PASTE SN42/BI58 250G

    Chip Quik Inc.

    4
    RFQ
    SMDLTLFP250T3

    Tabla de datos

    - Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 3 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    SMDLTLFP250T4

    SMDLTLFP250T4

    SOLDER PASTE LOW TEMP T4 250G

    Chip Quik Inc.

    6
    RFQ
    SMDLTLFP250T4

    Tabla de datos

    - Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    TS391LT250

    TS391LT250

    THERMALLY STABLE SOLDER PASTE NO

    Chip Quik Inc.

    18
    RFQ
    TS391LT250

    Tabla de datos

    - Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Jar, 8.8 oz (250g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
    NCSWLF.031 1LB

    NCSWLF.031 1LB

    LF SOLDER WIRE 96.5/3/0.5 TIN/SI

    Chip Quik Inc.

    8
    RFQ
    NCSWLF.031 1LB

    Tabla de datos

    - Bulk Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031" (0.79mm) 422 ~ 428°F (217 ~ 220°C) No-Clean 20 AWG, 21 SWG - Lead Free Spool, 1 lb (454 g) - - -
    24-6337-6401

    24-6337-6401

    SOLDER WATER SOLUABLE 24AWG 1LB

    Kester Solder

    21
    RFQ
    24-6337-6401

    Tabla de datos

    331 Spool Active Wire Solder Sn63Pb37 (63/37) 0.020" (0.51mm) 361°F (183°C) Water Soluble 24 AWG, 25 SWG - Leaded Spool, 1 lb (454 g) 36 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    SMD291AX250T5

    SMD291AX250T5

    SOLDER PASTE SN63/PB37 250G T5

    Chip Quik Inc.

    15
    RFQ
    SMD291AX250T5

    Tabla de datos

    - Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 5 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    24-6040-9713

    24-6040-9713

    SOLDER FLUX-CORED/285 .031" 1LB

    Kester Solder

    19
    RFQ
    24-6040-9713

    Tabla de datos

    285 Bulk Active Wire Solder Sn60Pb40 (60/40) 0.031" (0.79mm) 361 ~ 374°F (183 ~ 190°C) Rosin Mildly Activated (RMA) 20 AWG, 22 SWG - Leaded Spool, 1 lb (454 g) 36 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    SMD4300AX250T5

    SMD4300AX250T5

    SOLDER PASTE SN63/PB37 250G T5

    Chip Quik Inc.

    14
    RFQ
    SMD4300AX250T5

    Tabla de datos

    CHIPQUIK® SMD4300 Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean, Water Soluble - 5 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    91-7482-3340

    91-7482-3340

    INNOLOT 2.2%/278 .040 250 G ROBO

    Kester Solder

    24
    RFQ
    91-7482-3340

    Tabla de datos

    - Box Active Wire Solder - 0.040" (1.02mm) - No-Clean - - Lead Free Spool - - -
    24-6040-0010

    24-6040-0010

    SOLDER RA 60/40 24AWG 1LB

    Kester Solder

    16
    RFQ
    24-6040-0010

    Tabla de datos

    44 Spool Active Wire Solder Sn60Pb40 (60/40) 0.020" (0.51mm) 361 ~ 374°F (183 ~ 190°C) Rosin Activated (RA) 24 AWG, 25 SWG - Leaded Spool, 1 lb (454 g) 36 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C)
    SMD291SNL250T5

    SMD291SNL250T5

    SOLDER PASTE SAC305 250G T5

    Chip Quik Inc.

    6
    RFQ
    SMD291SNL250T5

    Tabla de datos

    - Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 5 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
    WS991SNL500T4

    WS991SNL500T4

    SOLDER PASTE THERMALLY STABLE WS

    Chip Quik Inc.

    10
    RFQ
    WS991SNL500T4

    Tabla de datos

    CHIPQUIK® Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423°F (217°C) Water Soluble - 4 Lead Free Jar, 17.64 oz (500g) 6 Months Date of Manufacture -
    TS991SNL500T4

    TS991SNL500T4

    SOLDER PASTE THERMALLY STABLE NC

    Chip Quik Inc.

    9
    RFQ
    TS991SNL500T4

    Tabla de datos

    CHIPQUIK® Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423°F (217°C) No-Clean - 4 Lead Free Jar, 17.64 oz (500g) 12 Months Date of Manufacture -
    70-4825-0904

    70-4825-0904

    NP560 SN96.5AG3.0CU0.5 T4 100 GM

    Kester Solder

    12
    RFQ
    70-4825-0904

    Tabla de datos

    NP560 Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 424°F (217 ~ 218°C) No-Clean - 4 Lead Free Syringe, 3.53 oz (100g) 12 Months Date of Manufacture 32°F ~ 50°F (0°C ~ 10°C)
    24-7150-8800

    24-7150-8800

    SOLDER FLUX-CORED/245 .031" 1LB

    Kester Solder

    12
    RFQ
    24-7150-8800

    Tabla de datos

    245 Bulk Active Wire Solder Sn62Pb36Ag2 (62/36/2) 0.031" (0.79mm) 354°F (179°C) No-Clean 20 AWG, 22 SWG - Leaded Spool, 1 lb (454 g) - - 50°F ~ 104°F (10°C ~ 40°C)
    70-1002-0510

    70-1002-0510

    SOLDER 500G JAR, SN63/PB37

    Kester Solder

    15
    RFQ
    70-1002-0510

    Tabla de datos

    HydroMark 531 Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) Water Soluble - 3 Leaded Jar, 17.64 oz (500g) 6 Months Date of Manufacture 32°F ~ 50°F (0°C ~ 10°C)
    1993881

    1993881

    LOCTITEGC10SAC305T4 885 52U 500g

    Harimatec Inc.

    23
    RFQ
    1993881

    Tabla de datos

    LOCTITE® GC 10 Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423°F (217°C) No-Clean - - Lead Free Jar, 17.64 oz (500g) 12 Months Date of Manufacture 41°F ~ 77°F (5°C ~ 25°C)
    Total 1672 Record«Prev1... 1011121314151617...84Next»
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