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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    200-6313-9UN-1900

    200-6313-9UN-1900

    CONN SOCKET PGA ZIF 169POS GOLD

    3M

    3,226
    RFQ
    200-6313-9UN-1900

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 169 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    200-6315-9UN-1900

    200-6315-9UN-1900

    CONN SOCKET PGA ZIF 225POS GOLD

    3M

    2,838
    RFQ
    200-6315-9UN-1900

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 225 (15 x 15) 0.100" (2.54mm) - - - - - - 0.100" (2.54mm) - - - Polyethersulfone (PES) -55°C ~ 150°C
    200-6317-9UN-1900

    200-6317-9UN-1900

    CONN SOCKET PGA ZIF 289POS GOLD

    3M

    2,513
    RFQ
    200-6317-9UN-1900

    Tabla de datos

    Textool™ Bulk Obsolete PGA, ZIF (ZIP) 289 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
    1-390261-8

    1-390261-8

    CONN IC DIP SOCKET 24POS TIN

    TE Connectivity AMP Connectors

    2,052
    RFQ
    1-390261-8

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    8058-39G4

    8058-39G4

    CONN TRANSIST TO-5 8POS GOLD

    TE Connectivity AMP Connectors

    3,722
    RFQ

    -

    8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    1-390261-6

    1-390261-6

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    4,453
    RFQ
    1-390261-6

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    100-006-000

    100-006-000

    CONN IC DIP SOCKET 6POS GOLD

    3M

    3,095
    RFQ
    100-006-000

    Tabla de datos

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-008-000

    100-008-000

    CONN IC DIP SOCKET 8POS GOLD

    3M

    3,121
    RFQ
    100-008-000

    Tabla de datos

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-008-001

    100-008-001

    CONN IC DIP SOCKET 8POS GOLD

    3M

    4,320
    RFQ
    100-008-001

    Tabla de datos

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-010-000

    100-010-000

    CONN IC DIP SOCKET 10POS GOLD

    3M

    4,233
    RFQ
    100-010-000

    Tabla de datos

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-014-000

    100-014-000

    CONN IC DIP SOCKET 14POS GOLD

    3M

    3,207
    RFQ
    100-014-000

    Tabla de datos

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-014-001

    100-014-001

    CONN IC DIP SOCKET 14POS GOLD

    3M

    4,336
    RFQ
    100-014-001

    Tabla de datos

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-016-000

    100-016-000

    CONN IC DIP SOCKET 16POS GOLD

    3M

    4,060
    RFQ
    100-016-000

    Tabla de datos

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-016-001

    100-016-001

    CONN IC DIP SOCKET 16POS GOLD

    3M

    2,288
    RFQ
    100-016-001

    Tabla de datos

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-018-000

    100-018-000

    CONN IC DIP SOCKET 18POS GOLD

    3M

    3,265
    RFQ

    -

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-020-000

    100-020-000

    CONN IC DIP SOCKET 20POS GOLD

    3M

    4,461
    RFQ

    -

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-020-001

    100-020-001

    CONN IC DIP SOCKET 20POS GOLD

    3M

    4,509
    RFQ

    -

    100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-022-000

    100-022-000

    CONN IC DIP SOCKET 22POS GOLD

    3M

    4,162
    RFQ

    -

    100 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-024-000

    100-024-000

    CONN IC DIP SOCKET 24POS GOLD

    3M

    2,281
    RFQ

    -

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    100-024-001

    100-024-001

    CONN IC DIP SOCKET 24POS GOLD

    3M

    2,921
    RFQ

    -

    100 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    Total 19086 Record«Prev1... 922923924925926927928929...955Next»
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