Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo | Número de posiciones o clavijas (cuadrícula) | Paso: acoplamiento | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Material del contacto: acoplamiento | Tipo de montaje | Características | Terminación | Paso: poste | Acabado del contacto: poste | Espesor del acabado del contacto: poste | Material del contacto: Poste | Material de la carcasa | Temperatura de funcionamiento |
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116-93-950-61-007000CONN IC SKT DBL |
0 |
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116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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558-10-192M16-001104BGA SURFACE MOUNT 1.27MM |
0 |
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![]() Tabla de datos |
558 | Bulk | Active | BGA | 192 (16 x 16) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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550-80-296-19-131135PGA SOLDER TAIL |
0 |
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550 | Bulk | Active | PGA | 296 (19 x 19) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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116-43-964-61-006000CONN IC SKT DBL |
0 |
|
- |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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116-93-964-61-006000CONN IC SKT DBL |
0 |
|
- |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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518-77-192M16-001105CONN SOCKET PGA 192POS GOLD |
0 |
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518 | Bulk | Active | PGA | 192 (16 x 16) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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APH-0434-G-HAPH-0434-G-H |
0 |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1834-G-HAPH-1834-G-H |
0 |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1534-G-HAPH-1534-G-H |
0 |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1234-G-HAPH-1234-G-H |
0 |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0234-G-HAPH-0234-G-H |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0734-G-HAPH-0734-G-H |
0 |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0834-G-HAPH-0834-G-H |
0 |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APA-640-G-QADAPTER PLUG |
0 |
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![]() Tabla de datos |
APA | Tube | Active | - | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
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APA-640-G-CADAPTER PLUG |
0 |
|
![]() Tabla de datos |
APA | Bulk | Active | - | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
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APO-640-G-C.100" LOW PROFILE SCREW MACHINE |
0 |
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![]() Tabla de datos |
APO | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
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48-6503-31CONN IC DIP SOCKET 48POS GOLD |
0 |
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![]() Tabla de datos |
503 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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APH-1828-G-TAPH-1828-G-T |
0 |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1428-G-TAPH-1428-G-T |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1528-G-TAPH-1528-G-T |
0 |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |