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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APH-0624-G-H

    APH-0624-G-H

    APH-0624-G-H

    Samtec Inc.

    2,229
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0224-G-H

    APH-0224-G-H

    APH-0224-G-H

    Samtec Inc.

    2,439
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1624-G-H

    APH-1624-G-H

    APH-1624-G-H

    Samtec Inc.

    3,508
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0724-G-H

    APH-0724-G-H

    APH-0724-G-H

    Samtec Inc.

    2,221
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1724-G-H

    APH-1724-G-H

    APH-1724-G-H

    Samtec Inc.

    4,584
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    40-9503-21

    40-9503-21

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,253
    RFQ
    40-9503-21

    Tabla de datos

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-9503-31

    40-9503-31

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,515
    RFQ
    40-9503-31

    Tabla de datos

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-41-144-15-082001

    510-41-144-15-082001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    4,814
    RFQ
    510-41-144-15-082001

    Tabla de datos

    510 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-652-61-007000

    116-43-652-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,524
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-652-61-007000

    116-93-652-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,181
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-964-61-001000

    111-93-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,335
    RFQ

    -

    111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    7100265148

    7100265148

    TEXTOOLRECEPTACLES FOR DIP SOCKE

    3M

    4,128
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    116-93-648-61-008000

    116-93-648-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,636
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-964-41-001000

    122-13-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    4,800
    RFQ
    122-13-964-41-001000

    Tabla de datos

    122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    323-13-164-41-001000

    323-13-164-41-001000

    SOCKET 3 LEVEL WRAPOST SIP 64POS

    Mill-Max Manufacturing Corp.

    2,087
    RFQ
    323-13-164-41-001000

    Tabla de datos

    323 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-87-599-54-131111

    517-87-599-54-131111

    CONN SOCKET PGA 599POS GOLD

    Preci-Dip

    3,039
    RFQ
    517-87-599-54-131111

    Tabla de datos

    517 Bulk Active PGA 599 (54 x 54) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-93-642-61-001000

    116-93-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,934
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6508-212

    40-6508-212

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,552
    RFQ
    40-6508-212

    Tabla de datos

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6508-312

    40-6508-312

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,960
    RFQ
    40-6508-312

    Tabla de datos

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-43-950-61-003000

    116-43-950-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,138
    RFQ

    -

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 846847848849850851852853...955Next»
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