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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APH-0524-G-H

    APH-0524-G-H

    APH-0524-G-H

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1524-G-H

    APH-1524-G-H

    APH-1524-G-H

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1824-G-H

    APH-1824-G-H

    APH-1824-G-H

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1224-G-H

    APH-1224-G-H

    APH-1224-G-H

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0424-G-H

    APH-0424-G-H

    APH-0424-G-H

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0324-G-H

    APH-0324-G-H

    APH-0324-G-H

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1324-G-H

    APH-1324-G-H

    APH-1324-G-H

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0824-G-H

    APH-0824-G-H

    APH-0824-G-H

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    115-43-640-61-001000

    115-43-640-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-316-61-001000

    116-43-316-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-316-61-001000

    116-93-316-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-1111-TT-22-L

    HLS-1111-TT-22-L

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-1111-TT-22-L

    Tabla de datos

    HLS Bulk Active SIP 121 (11 x 11) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    510-41-068-10-001001

    510-41-068-10-001001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    510-41-068-10-001001

    Tabla de datos

    510 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-145-15-001101

    550-10-145-15-001101

    PGA SOLDER TAIL

    Preci-Dip

    0
    RFQ
    550-10-145-15-001101

    Tabla de datos

    550 Bulk Active PGA 145 (15 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    39-0511-11

    39-0511-11

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    0
    RFQ
    39-0511-11

    Tabla de datos

    511 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-1508-21

    40-1508-21

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    0
    RFQ
    40-1508-21

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    40-1508-31

    40-1508-31

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    0
    RFQ
    40-1508-31

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    32-C182-21

    32-C182-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    0
    RFQ
    32-C182-21

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-C182-31

    32-C182-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    0
    RFQ
    32-C182-31

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-C212-31

    32-C212-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    0
    RFQ
    32-C212-31

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 814815816817818819820821...955Next»
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