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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APH-0816-G-R

    APH-0816-G-R

    APH-0816-G-R

    Samtec Inc.

    3,483
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1316-G-R

    APH-1316-G-R

    APH-1316-G-R

    Samtec Inc.

    3,888
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0716-G-R

    APH-0716-G-R

    APH-0716-G-R

    Samtec Inc.

    3,990
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0316-G-R

    APH-0316-G-R

    APH-0316-G-R

    Samtec Inc.

    3,286
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1216-G-R

    APH-1216-G-R

    APH-1216-G-R

    Samtec Inc.

    2,460
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    123-11-642-41-001000

    123-11-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,444
    RFQ
    123-11-642-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-628-G-H

    APO-628-G-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,840
    RFQ
    APO-628-G-H

    Tabla de datos

    APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    126-93-650-41-002000

    126-93-650-41-002000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    2,864
    RFQ
    126-93-650-41-002000

    Tabla de datos

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-650-41-002000

    126-43-650-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,805
    RFQ
    126-43-650-41-002000

    Tabla de datos

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-6621-30

    48-6621-30

    CONN IC DIP SOCKET 48POS TIN

    Aries Electronics

    2,429
    RFQ
    48-6621-30

    Tabla de datos

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    225-PGM15001-10

    225-PGM15001-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,735
    RFQ
    225-PGM15001-10

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-99-964-61-001000

    110-99-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,385
    RFQ

    -

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-952-41-004000

    612-41-952-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,723
    RFQ
    612-41-952-41-004000

    Tabla de datos

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-952-41-004000

    612-91-952-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,454
    RFQ
    612-91-952-41-004000

    Tabla de datos

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-11-648-41-001000

    122-11-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,105
    RFQ
    122-11-648-41-001000

    Tabla de datos

    122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-652-41-001000

    116-93-652-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    4,164
    RFQ
    116-93-652-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-652-41-001000

    116-43-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,504
    RFQ
    116-43-652-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-640-61-001000

    115-93-640-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,030
    RFQ

    -

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-314-61-105000

    110-43-314-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,635
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-314-61-105000

    110-93-314-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,088
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 784785786787788789790791...955Next»
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