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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    115-44-650-61-003000

    115-44-650-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,860
    RFQ

    -

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-648-41-003000

    612-43-648-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,251
    RFQ
    612-43-648-41-003000

    Tabla de datos

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-648-41-003000

    612-93-648-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,676
    RFQ
    612-93-648-41-003000

    Tabla de datos

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-322-61-003000

    116-43-322-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,624
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-422-61-003000

    116-93-422-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,095
    RFQ

    -

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0414-G-2

    HLS-0414-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,601
    RFQ
    HLS-0414-G-2

    Tabla de datos

    HLS Bulk Active SIP 56 (4 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    315-13-164-41-001000

    315-13-164-41-001000

    SOCKET LOW PROFILE SIP 64POS

    Mill-Max Manufacturing Corp.

    4,720
    RFQ

    -

    315 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-632-61-605000

    110-43-632-61-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,798
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-632-61-605000

    110-93-632-61-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,829
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-306-61-001000

    116-93-306-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,751
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    22-4508-21

    22-4508-21

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,266
    RFQ
    22-4508-21

    Tabla de datos

    508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    22-4508-31

    22-4508-31

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,077
    RFQ
    22-4508-31

    Tabla de datos

    508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    121-11-652-41-001000

    121-11-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,591
    RFQ
    121-11-652-41-001000

    Tabla de datos

    121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-13-628-41-801000

    122-13-628-41-801000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    2,720
    RFQ
    122-13-628-41-801000

    Tabla de datos

    122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-642-41-003000

    126-93-642-41-003000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    3,829
    RFQ
    126-93-642-41-003000

    Tabla de datos

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-642-41-003000

    126-43-642-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,985
    RFQ
    126-43-642-41-003000

    Tabla de datos

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-324-61-003000

    116-43-324-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,439
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-624-61-003000

    116-43-624-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,238
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-424-61-003000

    116-93-424-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,876
    RFQ

    -

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-624-61-003000

    116-93-624-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,661
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 775776777778779780781782...955Next»
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