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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-43-306-61-007000

    116-43-306-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,074
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-652-41-001000

    126-93-652-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    3,182
    RFQ
    126-93-652-41-001000

    Tabla de datos

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-652-41-001000

    126-43-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,687
    RFQ
    126-43-652-41-001000

    Tabla de datos

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-1840-T-T

    APH-1840-T-T

    APH-1840-T-T

    Samtec Inc.

    2,886
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1540-T-T

    APH-1540-T-T

    APH-1540-T-T

    Samtec Inc.

    4,371
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1740-T-T

    APH-1740-T-T

    APH-1740-T-T

    Samtec Inc.

    2,195
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    614-93-650-41-001000

    614-93-650-41-001000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    4,864
    RFQ
    614-93-650-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-650-41-001000

    614-43-650-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,734
    RFQ
    614-43-650-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-6508-20

    48-6508-20

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    2,078
    RFQ
    48-6508-20

    Tabla de datos

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    48-6508-30

    48-6508-30

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    3,188
    RFQ
    48-6508-30

    Tabla de datos

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    123-13-432-41-001000

    123-13-432-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    4,709
    RFQ
    123-13-432-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-13-632-41-001000

    123-13-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    2,977
    RFQ
    123-13-632-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-642-41-004000

    612-43-642-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,761
    RFQ
    612-43-642-41-004000

    Tabla de datos

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-642-41-004000

    612-93-642-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,873
    RFQ
    612-93-642-41-004000

    Tabla de datos

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-87-175-16-072112

    614-87-175-16-072112

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    3,081
    RFQ
    614-87-175-16-072112

    Tabla de datos

    614 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-13-624-41-801000

    123-13-624-41-801000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    4,789
    RFQ
    123-13-624-41-801000

    Tabla de datos

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-93-652-41-001000

    123-93-652-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    3,697
    RFQ
    123-93-652-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-43-652-41-001000

    123-43-652-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,121
    RFQ
    123-43-652-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    34-0508-21

    34-0508-21

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    3,517
    RFQ
    34-0508-21

    Tabla de datos

    508 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    34-0508-31

    34-0508-31

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    3,221
    RFQ
    34-0508-31

    Tabla de datos

    508 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    Total 19086 Record«Prev1... 767768769770771772773774...955Next»
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