Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    2-822114-4

    2-822114-4

    CONN SOCKET PQFP 160POS TIN-LEAD

    TE Connectivity AMP Connectors

    4,550
    RFQ
    2-822114-4

    Tabla de datos

    - Tube Obsolete QFP 160 (4 x 40) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
    122-11-640-41-001000

    122-11-640-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,646
    RFQ
    122-11-640-41-001000

    Tabla de datos

    122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    1051420133

    1051420133

    CONN SOCKET LGA 2011POS GOLD

    Molex

    4,577
    RFQ
    1051420133

    Tabla de datos

    105142 Tray Obsolete LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - - Thermoplastic -
    115-44-636-61-003000

    115-44-636-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,949
    RFQ

    -

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-650-61-001000

    110-44-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,013
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-636-41-004000

    612-43-636-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,219
    RFQ
    612-43-636-41-004000

    Tabla de datos

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-93-636-41-004000

    612-93-636-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,056
    RFQ
    612-93-636-41-004000

    Tabla de datos

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6621-30

    40-6621-30

    CONN IC DIP SOCKET 40POS TIN

    Aries Electronics

    4,624
    RFQ
    40-6621-30

    Tabla de datos

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-41-950-41-001000

    612-41-950-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,950
    RFQ
    612-41-950-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-950-41-001000

    612-91-950-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,880
    RFQ
    612-91-950-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    42-3570-10

    42-3570-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    4,546
    RFQ
    42-3570-10

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    110-43-318-61-105000

    110-43-318-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,090
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-6823-90T

    48-6823-90T

    CONN IC DIP SOCKET 48POS TIN

    Aries Electronics

    2,815
    RFQ
    48-6823-90T

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    110-91-636-61-001000

    110-91-636-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,806
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-44-428-61-003000

    115-44-428-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,585
    RFQ

    -

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-11-636-41-001000

    612-11-636-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,507
    RFQ
    612-11-636-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-13-640-41-001000

    121-13-640-41-001000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    3,779
    RFQ
    121-13-640-41-001000

    Tabla de datos

    121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    30-3503-21

    30-3503-21

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,375
    RFQ
    30-3503-21

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    30-3503-31

    30-3503-31

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,539
    RFQ
    30-3503-31

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    612-41-650-41-003000

    612-41-650-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,567
    RFQ
    612-41-650-41-003000

    Tabla de datos

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 756757758759760761762763...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios