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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    517-87-419-19-111111

    517-87-419-19-111111

    CONN SOCKET PGA 419POS GOLD

    Preci-Dip

    4,858
    RFQ
    517-87-419-19-111111

    Tabla de datos

    517 Bulk Active PGA 419 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-41-952-31-007000

    614-41-952-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,353
    RFQ
    614-41-952-31-007000

    Tabla de datos

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-952-31-007000

    614-91-952-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,192
    RFQ
    614-91-952-31-007000

    Tabla de datos

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    8080-1G9

    8080-1G9

    CONN TRANSIST TO-3 4POS GOLD

    TE Connectivity AMP Connectors

    2,900
    RFQ
    8080-1G9

    Tabla de datos

    8080 Bulk Active Transistor, TO-3 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Fluoropolymer (FP) -55°C ~ 125°C
    1825088-4

    1825088-4

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    2,925
    RFQ
    1825088-4

    Tabla de datos

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) - - Brass Thermoplastic -55°C ~ 125°C
    30-0511-11

    30-0511-11

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    3,927
    RFQ
    30-0511-11

    Tabla de datos

    511 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    550-10-114-13-062101

    550-10-114-13-062101

    PGA SOLDER TAIL

    Preci-Dip

    2,857
    RFQ
    550-10-114-13-062101

    Tabla de datos

    550 Bulk Active PGA 114 (13 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    48-6556-20

    48-6556-20

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    3,504
    RFQ
    48-6556-20

    Tabla de datos

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    126-93-636-41-002000

    126-93-636-41-002000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    3,949
    RFQ
    126-93-636-41-002000

    Tabla de datos

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-636-41-002000

    126-43-636-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,234
    RFQ
    126-43-636-41-002000

    Tabla de datos

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    180-PGM18006-10

    180-PGM18006-10

    PIN GRID ARRAY SOCKET 180PIN

    Aries Electronics

    4,321
    RFQ

    -

    PGM - Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    612-93-640-41-001000

    612-93-640-41-001000

    SOCKET CARRIER SLDRTL .600 40POS

    Mill-Max Manufacturing Corp.

    3,902
    RFQ
    612-93-640-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-308-61-007000

    116-93-308-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,548
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-640-41-001000

    612-43-640-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,033
    RFQ
    612-43-640-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-650-11-480000

    605-93-650-11-480000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    2,521
    RFQ
    605-93-650-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-650-11-480000

    605-43-650-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    4,507
    RFQ
    605-43-650-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-87-420-19-111111

    517-87-420-19-111111

    CONN SOCKET PGA 420POS GOLD

    Preci-Dip

    3,972
    RFQ
    517-87-420-19-111111

    Tabla de datos

    517 Bulk Active PGA 420 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0220-G-11

    HLS-0220-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,340
    RFQ
    HLS-0220-G-11

    Tabla de datos

    HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-11-964-41-001000

    110-11-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,782
    RFQ
    110-11-964-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-964-41-001000

    210-11-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,888
    RFQ
    210-11-964-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 740741742743744745746747...955Next»
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