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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-91-950-41-007000

    116-91-950-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,333
    RFQ
    116-91-950-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0220-G-12

    HLS-0220-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,693
    RFQ
    HLS-0220-G-12

    Tabla de datos

    HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-93-064-01-505000

    110-93-064-01-505000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,464
    RFQ
    110-93-064-01-505000

    Tabla de datos

    110 Tube Active - 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - - - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - - -
    44-6556-11

    44-6556-11

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    4,241
    RFQ
    44-6556-11

    Tabla de datos

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    605-93-648-11-480000

    605-93-648-11-480000

    SOCKET CARRIER LOWPRO .600 48POS

    Mill-Max Manufacturing Corp.

    2,811
    RFQ
    605-93-648-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-648-11-480000

    605-43-648-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    2,333
    RFQ
    605-43-648-11-480000

    Tabla de datos

    605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-210-61-001000

    110-13-210-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,235
    RFQ

    -

    110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-13-320-41-801000

    123-13-320-41-801000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    3,174
    RFQ
    123-13-320-41-801000

    Tabla de datos

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-6508-211

    24-6508-211

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,165
    RFQ
    24-6508-211

    Tabla de datos

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-6508-311

    24-6508-311

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,301
    RFQ
    24-6508-311

    Tabla de datos

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-43-210-61-003000

    116-43-210-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,013
    RFQ

    -

    116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-210-61-003000

    116-93-210-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,161
    RFQ

    -

    116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-6503-31

    28-6503-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,766
    RFQ
    28-6503-31

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APA-422-G-M

    APA-422-G-M

    ADAPTER PLUG

    Samtec Inc.

    4,347
    RFQ
    APA-422-G-M

    Tabla de datos

    APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-1836-T-T

    APH-1836-T-T

    APH-1836-T-T

    Samtec Inc.

    2,438
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1436-T-T

    APH-1436-T-T

    APH-1436-T-T

    Samtec Inc.

    3,148
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1636-T-T

    APH-1636-T-T

    APH-1636-T-T

    Samtec Inc.

    3,426
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0836-T-T

    APH-0836-T-T

    APH-0836-T-T

    Samtec Inc.

    2,684
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1736-T-T

    APH-1736-T-T

    APH-1736-T-T

    Samtec Inc.

    4,146
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    116-93-636-41-001000

    116-93-636-41-001000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    4,674
    RFQ
    116-93-636-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 733734735736737738739740...955Next»
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