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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APH-1918-G-T

    APH-1918-G-T

    APH-1918-G-T

    Samtec Inc.

    2,773
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0618-G-T

    APH-0618-G-T

    APH-0618-G-T

    Samtec Inc.

    4,252
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1118-G-T

    APH-1118-G-T

    APH-1118-G-T

    Samtec Inc.

    4,938
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0218-G-T

    APH-0218-G-T

    APH-0218-G-T

    Samtec Inc.

    3,933
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1318-G-T

    APH-1318-G-T

    APH-1318-G-T

    Samtec Inc.

    2,850
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0718-G-T

    APH-0718-G-T

    APH-0718-G-T

    Samtec Inc.

    3,452
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1618-G-T

    APH-1618-G-T

    APH-1618-G-T

    Samtec Inc.

    3,711
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0818-G-T

    APH-0818-G-T

    APH-0818-G-T

    Samtec Inc.

    3,200
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1218-G-T

    APH-1218-G-T

    APH-1218-G-T

    Samtec Inc.

    2,867
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0318-G-T

    APH-0318-G-T

    APH-0318-G-T

    Samtec Inc.

    2,733
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    133-PGM13046-10

    133-PGM13046-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,066
    RFQ
    133-PGM13046-10

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    133-PGM14013-10

    133-PGM14013-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,129
    RFQ
    133-PGM14013-10

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    160-PGM15056-10

    160-PGM15056-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,450
    RFQ
    160-PGM15056-10

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-83-121-13-061112

    614-83-121-13-061112

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    3,862
    RFQ
    614-83-121-13-061112

    Tabla de datos

    614 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-41-642-41-001000

    116-41-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,961
    RFQ
    116-41-642-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-642-41-001000

    116-91-642-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,217
    RFQ
    116-91-642-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    316-93-132-41-001000

    316-93-132-41-001000

    SOCKET ELEVATED SIP 32POS

    Mill-Max Manufacturing Corp.

    2,202
    RFQ
    316-93-132-41-001000

    Tabla de datos

    316 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-163-31-018000

    714-43-163-31-018000

    CONN SOCKET SIP 63POS GOLD

    Mill-Max Manufacturing Corp.

    2,359
    RFQ
    714-43-163-31-018000

    Tabla de datos

    714 Bulk Active SIP 63 (1 x 63) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-6556-30

    48-6556-30

    UNIVERSAL TEST SOCKET 48POS

    Aries Electronics

    3,193
    RFQ

    -

    6556 - Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    48-3551-10

    48-3551-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    3,885
    RFQ
    48-3551-10

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 719720721722723724725726...955Next»
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