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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-43-650-41-006000

    116-43-650-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,571
    RFQ
    116-43-650-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0530-T-H

    APH-0530-T-H

    APH-0530-T-H

    Samtec Inc.

    3,020
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1530-T-H

    APH-1530-T-H

    APH-1530-T-H

    Samtec Inc.

    2,385
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1130-T-H

    APH-1130-T-H

    APH-1130-T-H

    Samtec Inc.

    3,867
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1730-T-H

    APH-1730-T-H

    APH-1730-T-H

    Samtec Inc.

    4,179
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1630-T-H

    APH-1630-T-H

    APH-1630-T-H

    Samtec Inc.

    4,294
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1330-T-H

    APH-1330-T-H

    APH-1330-T-H

    Samtec Inc.

    3,930
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1230-T-H

    APH-1230-T-H

    APH-1230-T-H

    Samtec Inc.

    4,769
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    714-43-234-31-018000

    714-43-234-31-018000

    CONN IC DIP SOCKET 34POS GOLD

    Mill-Max Manufacturing Corp.

    4,055
    RFQ
    714-43-234-31-018000

    Tabla de datos

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-636-31-018000

    614-93-636-31-018000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    3,969
    RFQ
    614-93-636-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-636-31-018000

    614-43-636-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,678
    RFQ
    614-43-636-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-C182-20

    28-C182-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,486
    RFQ
    28-C182-20

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C182-30

    28-C182-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,394
    RFQ
    28-C182-30

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C212-20

    28-C212-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,513
    RFQ
    28-C212-20

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C212-30

    28-C212-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,385
    RFQ
    28-C212-30

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C300-20

    28-C300-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,387
    RFQ
    28-C300-20

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C300-30

    28-C300-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,775
    RFQ
    28-C300-30

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-41-432-41-004000

    612-41-432-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,716
    RFQ
    612-41-432-41-004000

    Tabla de datos

    612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-632-41-004000

    612-41-632-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,255
    RFQ
    612-41-632-41-004000

    Tabla de datos

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-432-41-004000

    612-91-432-41-004000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,128
    RFQ
    612-91-432-41-004000

    Tabla de datos

    612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 705706707708709710711712...955Next»
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