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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    122-13-624-41-001000

    122-13-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    4,775
    RFQ
    122-13-624-41-001000

    Tabla de datos

    122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0928-T-R

    APH-0928-T-R

    APH-0928-T-R

    Samtec Inc.

    3,707
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0728-T-R

    APH-0728-T-R

    APH-0728-T-R

    Samtec Inc.

    2,207
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1228-T-R

    APH-1228-T-R

    APH-1228-T-R

    Samtec Inc.

    3,919
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0228-T-R

    APH-0228-T-R

    APH-0228-T-R

    Samtec Inc.

    4,971
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1628-T-R

    APH-1628-T-R

    APH-1628-T-R

    Samtec Inc.

    2,095
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    44-6556-30

    44-6556-30

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    2,568
    RFQ
    44-6556-30

    Tabla de datos

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    44-6556-20

    44-6556-20

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    4,552
    RFQ
    44-6556-20

    Tabla de datos

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    24-3551-11

    24-3551-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    4,055
    RFQ
    24-3551-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3552-11

    24-3552-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    4,621
    RFQ
    24-3552-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3553-11

    24-3553-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    2,940
    RFQ
    24-3553-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6551-11

    24-6551-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    4,836
    RFQ
    24-6551-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6552-11

    24-6552-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    4,359
    RFQ
    24-6552-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3554-11

    24-3554-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    2,284
    RFQ
    24-3554-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    210790-4

    210790-4

    CONN SOCKET PGA 128POS GOLD

    TE Connectivity AMP Connectors

    2,349
    RFQ
    210790-4

    Tabla de datos

    STA Bulk Obsolete PGA 128 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 118.1µin (3.00µm) Phosphor Bronze Thermoplastic, Polyester, Glass Filled -
    24-3503-31

    24-3503-31

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,892
    RFQ
    24-3503-31

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6572-10

    40-6572-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    2,413
    RFQ
    40-6572-10

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    APA-648-T-C

    APA-648-T-C

    ADAPTER PLUG

    Samtec Inc.

    4,389
    RFQ
    APA-648-T-C

    Tabla de datos

    APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    126-93-432-41-001000

    126-93-432-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    3,705
    RFQ
    126-93-432-41-001000

    Tabla de datos

    126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-632-41-001000

    126-93-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    3,357
    RFQ
    126-93-632-41-001000

    Tabla de datos

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 691692693694695696697698...955Next»
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