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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    614-43-428-41-001000

    614-43-428-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,473
    RFQ
    614-43-428-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-628-41-001000

    614-43-628-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,686
    RFQ
    614-43-628-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-9503-20

    40-9503-20

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,012
    RFQ
    40-9503-20

    Tabla de datos

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-9503-30

    40-9503-30

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,000
    RFQ
    40-9503-30

    Tabla de datos

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-3508-212

    18-3508-212

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,968
    RFQ
    18-3508-212

    Tabla de datos

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    614-93-432-31-012000

    614-93-432-31-012000

    SOCKET CARRIER LOWPRO .400 32POS

    Mill-Max Manufacturing Corp.

    4,838
    RFQ
    614-93-432-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-432-31-012000

    614-43-432-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,285
    RFQ
    614-43-432-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-9513-11H

    40-9513-11H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,911
    RFQ
    40-9513-11H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    117-41-656-41-005000

    117-41-656-41-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,700
    RFQ
    117-41-656-41-005000

    Tabla de datos

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-91-656-41-005000

    117-91-656-41-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,769
    RFQ
    117-91-656-41-005000

    Tabla de datos

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-648-41-007000

    116-47-648-41-007000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    4,741
    RFQ
    116-47-648-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-328-41-001000

    121-11-328-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,398
    RFQ
    121-11-328-41-001000

    Tabla de datos

    121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-428-41-001000

    121-11-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,766
    RFQ
    121-11-428-41-001000

    Tabla de datos

    121 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-628-41-001000

    121-11-628-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,637
    RFQ
    121-11-628-41-001000

    Tabla de datos

    121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    31-7400-10

    31-7400-10

    CONN SOCKET SIP 31POS TIN

    Aries Electronics

    3,887
    RFQ
    31-7400-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    31-7440-10

    31-7440-10

    CONN SOCKET SIP 31POS TIN

    Aries Electronics

    3,524
    RFQ
    31-7440-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    31-7500-10

    31-7500-10

    CONN SOCKET SIP 31POS TIN

    Aries Electronics

    3,960
    RFQ
    31-7500-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-3508-212

    16-3508-212

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,228
    RFQ
    16-3508-212

    Tabla de datos

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-3508-312

    16-3508-312

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,261
    RFQ
    16-3508-312

    Tabla de datos

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    114-41-950-41-117000

    114-41-950-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,618
    RFQ
    114-41-950-41-117000

    Tabla de datos

    114 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 675676677678679680681682...955Next»
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