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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APH-0226-T-R

    APH-0226-T-R

    APH-0226-T-R

    Samtec Inc.

    3,520
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1326-T-R

    APH-1326-T-R

    APH-1326-T-R

    Samtec Inc.

    3,828
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0828-T-T

    APH-0828-T-T

    APH-0828-T-T

    Samtec Inc.

    3,579
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1628-T-T

    APH-1628-T-T

    APH-1628-T-T

    Samtec Inc.

    4,411
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1126-T-R

    APH-1126-T-R

    APH-1126-T-R

    Samtec Inc.

    3,319
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    123-13-422-41-801000

    123-13-422-41-801000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    4,361
    RFQ
    123-13-422-41-801000

    Tabla de datos

    123 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6553-11

    32-6553-11

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    3,848
    RFQ
    32-6553-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    110-41-320-61-001000

    110-41-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,157
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-320-61-001000

    110-43-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,241
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-320-61-001000

    110-91-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,735
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-432-31-018000

    614-41-432-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,951
    RFQ
    614-41-432-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-632-31-018000

    614-41-632-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,549
    RFQ
    614-41-632-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-432-31-018000

    614-91-432-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,892
    RFQ
    614-91-432-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-632-31-018000

    614-91-632-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,813
    RFQ
    614-91-632-31-018000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-93-132-31-012000

    714-93-132-31-012000

    SOCKET CARRIER SIP 32POS

    Mill-Max Manufacturing Corp.

    2,387
    RFQ
    714-93-132-31-012000

    Tabla de datos

    714 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    29-71250-10

    29-71250-10

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    4,501
    RFQ
    29-71250-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    29-7600-10

    29-7600-10

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    4,341
    RFQ
    29-7600-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    29-7625-10

    29-7625-10

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    3,201
    RFQ
    29-7625-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-6810-90

    20-6810-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,982
    RFQ
    20-6810-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    116-41-650-41-006000

    116-41-650-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,306
    RFQ
    116-41-650-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 660661662663664665666667...955Next»
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