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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-91-648-41-006000

    116-91-648-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,192
    RFQ
    116-91-648-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-309-21-001101

    510-83-309-21-001101

    CONN SOCKET PGA 309POS GOLD

    Preci-Dip

    3,480
    RFQ
    510-83-309-21-001101

    Tabla de datos

    510 Bulk Active PGA 309 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    124-41-324-41-002000

    124-41-324-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,822
    RFQ
    124-41-324-41-002000

    Tabla de datos

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-41-424-41-002000

    124-41-424-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,671
    RFQ
    124-41-424-41-002000

    Tabla de datos

    124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-41-624-41-002000

    124-41-624-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,889
    RFQ
    124-41-624-41-002000

    Tabla de datos

    124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-324-41-002000

    124-91-324-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,433
    RFQ
    124-91-324-41-002000

    Tabla de datos

    124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-424-41-002000

    124-91-424-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,498
    RFQ
    124-91-424-41-002000

    Tabla de datos

    124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-624-41-002000

    124-91-624-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,191
    RFQ
    124-91-624-41-002000

    Tabla de datos

    124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-13-316-41-001000

    612-13-316-41-001000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    4,463
    RFQ
    612-13-316-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-328-31-002000

    614-43-328-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,737
    RFQ
    614-43-328-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-428-31-002000

    614-43-428-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,298
    RFQ
    614-43-428-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-628-31-002000

    614-43-628-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,280
    RFQ
    614-43-628-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-328-31-002000

    614-93-328-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,507
    RFQ
    614-93-328-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-428-31-002000

    614-93-428-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,692
    RFQ
    614-93-428-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-628-31-002000

    614-93-628-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,940
    RFQ
    614-93-628-31-002000

    Tabla de datos

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-11-432-41-770000

    104-11-432-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,622
    RFQ
    104-11-432-41-770000

    Tabla de datos

    104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-11-632-41-770000

    104-11-632-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,291
    RFQ
    104-11-632-41-770000

    Tabla de datos

    104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-80-144-15-081101

    550-80-144-15-081101

    PGA SOLDER TAIL

    Preci-Dip

    2,587
    RFQ
    550-80-144-15-081101

    Tabla de datos

    550 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-80-144-12-000101

    550-80-144-12-000101

    PGA SOLDER TAIL

    Preci-Dip

    4,067
    RFQ
    550-80-144-12-000101

    Tabla de datos

    550 Bulk Active PGA 144 (12 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-93-328-31-007000

    614-93-328-31-007000

    SOCKET CARRIER LOWPRO .300 28POS

    Mill-Max Manufacturing Corp.

    4,571
    RFQ
    614-93-328-31-007000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 651652653654655656657658...955Next»
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