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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APH-1724-T-H

    APH-1724-T-H

    APH-1724-T-H

    Samtec Inc.

    4,345
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0724-T-H

    APH-0724-T-H

    APH-0724-T-H

    Samtec Inc.

    4,811
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0824-T-H

    APH-0824-T-H

    APH-0824-T-H

    Samtec Inc.

    3,022
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    714-93-120-41-001000

    714-93-120-41-001000

    SOCKET CARRIER SIP 20POS

    Mill-Max Manufacturing Corp.

    4,678
    RFQ
    714-93-120-41-001000

    Tabla de datos

    714 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-640-ZWGT-2

    ICA-640-ZWGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,324
    RFQ
    ICA-640-ZWGT-2

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    28-81000-610C

    28-81000-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,585
    RFQ
    28-81000-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-81010-610C

    28-81010-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,953
    RFQ
    28-81010-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-81250-610C

    28-81250-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,010
    RFQ
    28-81250-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8240-610C

    28-8240-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,192
    RFQ
    28-8240-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8250-610C

    28-8250-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,930
    RFQ
    28-8250-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8300-610C

    28-8300-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,074
    RFQ
    28-8300-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8370-610C

    28-8370-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,582
    RFQ
    28-8370-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8375-610C

    28-8375-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,686
    RFQ
    28-8375-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8400-610C

    28-8400-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,688
    RFQ
    28-8400-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8459-610C

    28-8459-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,377
    RFQ
    28-8459-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8472-610C

    28-8472-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,826
    RFQ
    28-8472-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8495-610C

    28-8495-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,994
    RFQ
    28-8495-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8500-610C

    28-8500-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,494
    RFQ
    28-8500-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8600-610C

    28-8600-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,488
    RFQ
    28-8600-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-8620-610C

    28-8620-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,957
    RFQ
    28-8620-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 611612613614615616617618...955Next»
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