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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    614-91-422-41-001000

    614-91-422-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,171
    RFQ
    614-91-422-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-316-41-001000

    121-11-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,086
    RFQ
    121-11-316-41-001000

    Tabla de datos

    121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-41-648-41-001000

    111-41-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,914
    RFQ
    111-41-648-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-91-648-41-001000

    111-91-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,314
    RFQ
    111-91-648-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-210-41-105000

    110-47-210-41-105000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,826
    RFQ
    110-47-210-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    8080-1G39

    8080-1G39

    CONN TRANSIST TO-3 3POS GOLD

    TE Connectivity AMP Connectors

    2,188
    RFQ
    8080-1G39

    Tabla de datos

    8060 Bulk Obsolete Transistor, TO-3 3 (Oval) - Gold - Beryllium Copper Chassis Mount Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    32-3570-10

    32-3570-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    3,466
    RFQ
    32-3570-10

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3571-10

    32-3571-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,762
    RFQ
    32-3571-10

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3572-10

    32-3572-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    4,413
    RFQ
    32-3572-10

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3573-10

    32-3573-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,777
    RFQ
    32-3573-10

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    126-93-318-41-001000

    126-93-318-41-001000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    4,649
    RFQ
    126-93-318-41-001000

    Tabla de datos

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-318-41-001000

    126-43-318-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,911
    RFQ
    126-43-318-41-001000

    Tabla de datos

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-91-324-41-001000

    123-91-324-41-001000

    SOCKET IC OPEN 3 LVL .300 24POS

    Mill-Max Manufacturing Corp.

    3,608
    RFQ

    -

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-91-424-41-001000

    123-91-424-41-001000

    SOCKET IC OPEN 3 LVL .400 24POS

    Mill-Max Manufacturing Corp.

    4,308
    RFQ

    -

    123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-91-624-41-001000

    123-91-624-41-001000

    SOCKET IC OPEN 3 LVL .600 24POS

    Mill-Max Manufacturing Corp.

    2,716
    RFQ

    -

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-324-41-001000

    123-41-324-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,658
    RFQ
    123-41-324-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-424-41-001000

    123-41-424-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,141
    RFQ
    123-41-424-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-624-41-001000

    123-41-624-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,729
    RFQ
    123-41-624-41-001000

    Tabla de datos

    123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-11-432-41-001000

    110-11-432-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,222
    RFQ
    110-11-432-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-11-632-41-001000

    110-11-632-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,926
    RFQ
    110-11-632-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 598599600601602603604605...955Next»
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