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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-91-632-41-006000

    116-91-632-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,541
    RFQ
    116-91-632-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-226-31-018000

    714-43-226-31-018000

    CONN IC DIP SOCKET 26POS GOLD

    Mill-Max Manufacturing Corp.

    3,611
    RFQ
    714-43-226-31-018000

    Tabla de datos

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-322-31-012000

    614-41-322-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,433
    RFQ
    614-41-322-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-422-31-012000

    614-41-422-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,332
    RFQ
    614-41-422-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-322-31-012000

    614-91-322-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,364
    RFQ
    614-91-322-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-422-31-012000

    614-91-422-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,822
    RFQ
    614-91-422-31-012000

    Tabla de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    16-0511-11

    16-0511-11

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    2,020
    RFQ
    16-0511-11

    Tabla de datos

    511 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-41-320-41-001000

    116-41-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,634
    RFQ
    116-41-320-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-420-41-001000

    116-41-420-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,108
    RFQ
    116-41-420-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-320-41-001000

    116-91-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,642
    RFQ
    116-91-320-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-420-41-001000

    116-91-420-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,884
    RFQ
    116-91-420-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0424-T-T

    APH-0424-T-T

    APH-0424-T-T

    Samtec Inc.

    3,494
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1924-T-T

    APH-1924-T-T

    APH-1924-T-T

    Samtec Inc.

    3,819
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0924-T-T

    APH-0924-T-T

    APH-0924-T-T

    Samtec Inc.

    3,612
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1524-T-T

    APH-1524-T-T

    APH-1524-T-T

    Samtec Inc.

    4,605
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0224-T-T

    APH-0224-T-T

    APH-0224-T-T

    Samtec Inc.

    4,188
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0324-T-T

    APH-0324-T-T

    APH-0324-T-T

    Samtec Inc.

    2,125
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    116-93-324-41-003000

    116-93-324-41-003000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    2,062
    RFQ
    116-93-324-41-003000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-424-41-003000

    116-93-424-41-003000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    4,938
    RFQ
    116-93-424-41-003000

    Tabla de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-624-41-003000

    116-93-624-41-003000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    4,498
    RFQ
    116-93-624-41-003000

    Tabla de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 586587588589590591592593...955Next»
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