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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    110-93-428-41-105000

    110-93-428-41-105000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    3,439
    RFQ
    110-93-428-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-628-41-105000

    110-93-628-41-105000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    4,639
    RFQ
    110-93-628-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-428-41-105000

    110-43-428-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,878
    RFQ
    110-43-428-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-628-41-105000

    110-43-628-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,471
    RFQ
    110-43-628-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0922-T-R

    APH-0922-T-R

    APH-0922-T-R

    Samtec Inc.

    4,724
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1922-T-R

    APH-1922-T-R

    APH-1922-T-R

    Samtec Inc.

    2,203
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0222-T-R

    APH-0222-T-R

    APH-0222-T-R

    Samtec Inc.

    3,849
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1722-T-R

    APH-1722-T-R

    APH-1722-T-R

    Samtec Inc.

    4,633
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    116-93-316-41-008000

    116-93-316-41-008000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    3,614
    RFQ
    116-93-316-41-008000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-316-41-008000

    116-43-316-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,175
    RFQ
    116-43-316-41-008000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-2020-T-22

    HLS-2020-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,034
    RFQ
    HLS-2020-T-22

    Tabla de datos

    HLS Bulk Active SIP 400 (20 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    111-47-650-41-001000

    111-47-650-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,644
    RFQ
    111-47-650-41-001000

    Tabla de datos

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-43-119-41-005000

    317-43-119-41-005000

    CONN SKT STRIP

    Mill-Max Manufacturing Corp.

    2,120
    RFQ
    317-43-119-41-005000

    Tabla de datos

    317 Bulk Active SIP 19 (1 x 19) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-316-41-001000

    612-41-316-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,669
    RFQ
    612-41-316-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-316-41-001000

    612-91-316-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,982
    RFQ
    612-91-316-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-632-41-605000

    110-93-632-41-605000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    3,902
    RFQ
    110-93-632-41-605000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-632-41-605000

    110-43-632-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,564
    RFQ
    110-43-632-41-605000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6551-10

    32-6551-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,114
    RFQ
    32-6551-10

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3554-10

    32-3554-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    3,881
    RFQ
    32-3554-10

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6556-10

    44-6556-10

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    2,058
    RFQ
    44-6556-10

    Tabla de datos

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 580581582583584585586587...955Next»
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