Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    APH-0406-G-R

    APH-0406-G-R

    APH-0406-G-R

    Samtec Inc.

    4,776
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1806-G-R

    APH-1806-G-R

    APH-1806-G-R

    Samtec Inc.

    4,212
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    614-93-308-41-001000

    614-93-308-41-001000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    4,734
    RFQ
    614-93-308-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-308-41-001000

    614-43-308-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,032
    RFQ
    614-43-308-41-001000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-642-41-001000

    110-47-642-41-001000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    4,960
    RFQ
    110-47-642-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-324-WGG-3

    ICA-324-WGG-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,700
    RFQ
    ICA-324-WGG-3

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    317-91-116-41-005000

    317-91-116-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    3,621
    RFQ
    317-91-116-41-005000

    Tabla de datos

    317 Bulk Active SIP 16 (1 x 16) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-632-LGG

    ICO-632-LGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,004
    RFQ
    ICO-632-LGG

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    20-7800-10

    20-7800-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    3,160
    RFQ
    20-7800-10

    Tabla de datos

    700 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Carrier, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-0501-21

    15-0501-21

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    4,790
    RFQ
    15-0501-21

    Tabla de datos

    501 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    15-0501-31

    15-0501-31

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    3,465
    RFQ
    15-0501-31

    Tabla de datos

    501 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-7385-10

    20-7385-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    3,957
    RFQ
    20-7385-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7390-10

    20-7390-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    4,388
    RFQ
    20-7390-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7394-10

    20-7394-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    2,069
    RFQ
    20-7394-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7400-10

    20-7400-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    4,183
    RFQ
    20-7400-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7405-10

    20-7405-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    3,708
    RFQ
    20-7405-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7415-10

    20-7415-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    3,990
    RFQ
    20-7415-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7420-10

    20-7420-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    3,824
    RFQ
    20-7420-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7430-10

    20-7430-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    2,151
    RFQ
    20-7430-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7435-10

    20-7435-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    3,285
    RFQ
    20-7435-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 519520521522523524525526...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios