Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-91-314-41-006000

    116-91-314-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,120
    RFQ
    116-91-314-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-47-632-41-001000

    210-47-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    4,050
    RFQ
    210-47-632-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-41-108-41-005000

    917-41-108-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    2,887
    RFQ
    917-41-108-41-005000

    Tabla de datos

    917 Tube Active Transistor, TO-5 8 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-41-208-41-005000

    917-41-208-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    3,288
    RFQ
    917-41-208-41-005000

    Tabla de datos

    917 Tube Active Transistor, TO-100 8 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-91-108-41-005000

    917-91-108-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    2,780
    RFQ
    917-91-108-41-005000

    Tabla de datos

    917 Tube Active Transistor, TO-5 8 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-91-208-41-005000

    917-91-208-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    2,036
    RFQ
    917-91-208-41-005000

    Tabla de datos

    917 Tube Active Transistor, TO-100 8 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-43-109-41-005000

    317-43-109-41-005000

    CONN SKT STRIP

    Mill-Max Manufacturing Corp.

    2,840
    RFQ
    317-43-109-41-005000

    Tabla de datos

    317 Bulk Active SIP 9 (1 x 9) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-0508-20

    36-0508-20

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    3,094
    RFQ
    36-0508-20

    Tabla de datos

    508 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    36-0508-30

    36-0508-30

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    4,949
    RFQ
    36-0508-30

    Tabla de datos

    508 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    36-1508-20

    36-1508-20

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    4,460
    RFQ
    36-1508-20

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    612-93-306-41-001000

    612-93-306-41-001000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    2,453
    RFQ
    612-93-306-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-306-41-001000

    612-43-306-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,889
    RFQ
    612-43-306-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-310-41-001000

    116-47-310-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,083
    RFQ
    116-47-310-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-322-41-003000

    115-91-322-41-003000

    SOCKET IC OPEN LOWPRO .300 22POS

    Mill-Max Manufacturing Corp.

    2,750
    RFQ

    -

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
    115-41-322-41-003000

    115-41-322-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,500
    RFQ
    115-41-322-41-003000

    Tabla de datos

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-47-322-41-117000

    114-47-322-41-117000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,252
    RFQ
    114-47-322-41-117000

    Tabla de datos

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-47-422-41-117000

    114-47-422-41-117000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,762
    RFQ
    114-47-422-41-117000

    Tabla de datos

    114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    18-6501-21

    18-6501-21

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,049
    RFQ
    18-6501-21

    Tabla de datos

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    18-6501-31

    18-6501-31

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,961
    RFQ
    18-6501-31

    Tabla de datos

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-6823-90T

    28-6823-90T

    CONN IC DIP SOCKET 28POS TIN

    Aries Electronics

    4,657
    RFQ
    28-6823-90T

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    Total 19086 Record«Prev1... 498499500501502503504505...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios