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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-91-314-41-006000

    116-91-314-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,120
    RFQ
    116-91-314-41-006000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-47-632-41-001000

    210-47-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    4,050
    RFQ
    210-47-632-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-41-108-41-005000

    917-41-108-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    2,887
    RFQ
    917-41-108-41-005000

    Tabla de datos

    917 Tube Active Transistor, TO-5 8 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-41-208-41-005000

    917-41-208-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    3,288
    RFQ
    917-41-208-41-005000

    Tabla de datos

    917 Tube Active Transistor, TO-100 8 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-91-108-41-005000

    917-91-108-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    2,780
    RFQ
    917-91-108-41-005000

    Tabla de datos

    917 Tube Active Transistor, TO-5 8 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-91-208-41-005000

    917-91-208-41-005000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    2,036
    RFQ
    917-91-208-41-005000

    Tabla de datos

    917 Tube Active Transistor, TO-100 8 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-43-109-41-005000

    317-43-109-41-005000

    CONN SKT STRIP

    Mill-Max Manufacturing Corp.

    2,840
    RFQ
    317-43-109-41-005000

    Tabla de datos

    317 Bulk Active SIP 9 (1 x 9) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-0508-20

    36-0508-20

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    3,094
    RFQ
    36-0508-20

    Tabla de datos

    508 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    36-0508-30

    36-0508-30

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    4,949
    RFQ
    36-0508-30

    Tabla de datos

    508 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    36-1508-20

    36-1508-20

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    4,460
    RFQ
    36-1508-20

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    612-93-306-41-001000

    612-93-306-41-001000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    2,453
    RFQ
    612-93-306-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-43-306-41-001000

    612-43-306-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,889
    RFQ
    612-43-306-41-001000

    Tabla de datos

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-310-41-001000

    116-47-310-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,083
    RFQ
    116-47-310-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-322-41-003000

    115-91-322-41-003000

    SOCKET IC OPEN LOWPRO .300 22POS

    Mill-Max Manufacturing Corp.

    2,750
    RFQ

    -

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
    115-41-322-41-003000

    115-41-322-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,500
    RFQ
    115-41-322-41-003000

    Tabla de datos

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-47-322-41-117000

    114-47-322-41-117000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,252
    RFQ
    114-47-322-41-117000

    Tabla de datos

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-47-422-41-117000

    114-47-422-41-117000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,762
    RFQ
    114-47-422-41-117000

    Tabla de datos

    114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    18-6501-21

    18-6501-21

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,049
    RFQ
    18-6501-21

    Tabla de datos

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    18-6501-31

    18-6501-31

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,961
    RFQ
    18-6501-31

    Tabla de datos

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-6823-90T

    28-6823-90T

    CONN IC DIP SOCKET 28POS TIN

    Aries Electronics

    4,657
    RFQ
    28-6823-90T

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    Total 19086 Record«Prev1... 498499500501502503504505...955Next»
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