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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    317-93-107-41-005000

    317-93-107-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,482
    RFQ
    317-93-107-41-005000

    Tabla de datos

    317 Bulk Active SIP 7 (1 x 7) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-41-320-41-001000

    210-41-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,522
    RFQ
    210-41-320-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-91-320-41-001000

    210-91-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,159
    RFQ
    210-91-320-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-308-41-007000

    116-47-308-41-007000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,230
    RFQ
    116-47-308-41-007000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-306-41-001000

    116-41-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,676
    RFQ
    116-41-306-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-306-41-001000

    116-91-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,692
    RFQ
    116-91-306-41-001000

    Tabla de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    16-6503-21

    16-6503-21

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,427
    RFQ
    16-6503-21

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-6503-31

    16-6503-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,058
    RFQ
    16-6503-31

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    18-0503-21

    18-0503-21

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    3,009
    RFQ
    18-0503-21

    Tabla de datos

    0503 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    18-0503-31

    18-0503-31

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    3,875
    RFQ
    18-0503-31

    Tabla de datos

    0503 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    ICA-632-WGT-2

    ICA-632-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,347
    RFQ
    ICA-632-WGT-2

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    115-44-320-41-003000

    115-44-320-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,110
    RFQ
    115-44-320-41-003000

    Tabla de datos

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-220-31-018000

    714-43-220-31-018000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    2,507
    RFQ
    714-43-220-31-018000

    Tabla de datos

    714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-41-316-41-001000

    210-41-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,207
    RFQ
    210-41-316-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-91-316-41-001000

    210-91-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,511
    RFQ
    210-91-316-41-001000

    Tabla de datos

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-93-104-41-005000

    317-93-104-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    3,937
    RFQ
    317-93-104-41-005000

    Tabla de datos

    317 Bulk Active SIP 4 (1 x 4) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-225-18-091101

    510-83-225-18-091101

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    4,150
    RFQ
    510-83-225-18-091101

    Tabla de datos

    510 Bulk Active PGA 225 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-93-306-31-007000

    614-93-306-31-007000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    3,939
    RFQ
    614-93-306-31-007000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-306-31-007000

    614-43-306-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,243
    RFQ
    614-43-306-31-007000

    Tabla de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-44-316-41-003000

    115-44-316-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,402
    RFQ
    115-44-316-41-003000

    Tabla de datos

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 475476477478479480481482...955Next»
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