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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    17-0508-21

    17-0508-21

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,149
    RFQ
    17-0508-21

    Tabla de datos

    508 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    17-0508-31

    17-0508-31

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    4,367
    RFQ
    17-0508-31

    Tabla de datos

    508 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    110-41-308-41-105000

    110-41-308-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,384
    RFQ
    110-41-308-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-308-41-105000

    110-91-308-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,818
    RFQ
    110-91-308-41-105000

    Tabla de datos

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    09-0511-11

    09-0511-11

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    3,939
    RFQ
    09-0511-11

    Tabla de datos

    511 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0214-G-2

    HLS-0214-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,239
    RFQ
    HLS-0214-G-2

    Tabla de datos

    HLS Tube Active SIP 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    19-71080-10

    19-71080-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    2,378
    RFQ
    19-71080-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-7375-10

    19-7375-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    3,178
    RFQ
    19-7375-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-7400-10

    19-7400-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    3,752
    RFQ
    19-7400-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-7650-10

    19-7650-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    4,229
    RFQ
    19-7650-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-7750-10

    19-7750-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    4,886
    RFQ
    19-7750-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81000-310C

    20-81000-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,742
    RFQ
    20-81000-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81156-310C

    20-81156-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,051
    RFQ
    20-81156-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81200-310C

    20-81200-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,032
    RFQ
    20-81200-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81250-310C

    20-81250-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,006
    RFQ
    20-81250-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8190-310C

    20-8190-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,932
    RFQ
    20-8190-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8240-310C

    20-8240-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,644
    RFQ
    20-8240-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8260-310C

    20-8260-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,422
    RFQ
    20-8260-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8280-310C

    20-8280-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,177
    RFQ
    20-8280-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8300-310C

    20-8300-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,619
    RFQ
    20-8300-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 19086 Record«Prev1... 460461462463464465466467...955Next»
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