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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    508-AG11D-LF

    508-AG11D-LF

    IC Socket, DIP8, 8 Contact(s), 2

    TE Connectivity

    6,542
    RFQ

    -

    * Tube Obsolete - - - - - - - - - - - - - - -
    1-1825094-4

    1-1825094-4

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    4,819
    RFQ
    1-1825094-4

    Tabla de datos

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    2-640361-4

    2-640361-4

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    3,160
    RFQ
    2-640361-4

    Tabla de datos

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Beryllium Copper Thermoplastic -55°C ~ 125°C
    1-1571995-0

    1-1571995-0

    CONN SOCKET SIP 10POS TIN

    TE Connectivity AMP Connectors

    2,343
    RFQ
    1-1571995-0

    Tabla de datos

    510 Tube Obsolete SIP 10 (2 x 5) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
    714-43-103-31-018000

    714-43-103-31-018000

    CONN SOCKET SIP 3POS GOLD

    Mill-Max Manufacturing Corp.

    1,358
    RFQ
    714-43-103-31-018000

    Tabla de datos

    714 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-87-322-41-001101

    110-87-322-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    3,247
    RFQ
    110-87-322-41-001101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    816-AG11D-ES

    816-AG11D-ES

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    3,238
    RFQ
    816-AG11D-ES

    Tabla de datos

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
    346-93-104-41-013000

    346-93-104-41-013000

    CONN SOCKET SIP 4POS GOLD

    Mill-Max Manufacturing Corp.

    597
    RFQ
    346-93-104-41-013000

    Tabla de datos

    346 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    1825376-2

    1825376-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    4,158
    RFQ
    1825376-2

    Tabla de datos

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    210-43-308-41-001

    210-43-308-41-001

    IC SOCKET 8-PIN .100" X .300" MA

    Mill-Max Manufacturing Corp.

    779
    RFQ

    -

    210 Box Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    818-AG11D-ESL-LF

    818-AG11D-ESL-LF

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    3,075
    RFQ
    818-AG11D-ESL-LF

    Tabla de datos

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    822516-4

    822516-4

    CONN SOCKET PLCC 52POS TIN

    TE Connectivity AMP Connectors

    3,901
    RFQ
    822516-4

    Tabla de datos

    - Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    3-822516-4

    3-822516-4

    CONN SOCKET PLCC 52POS TIN

    TE Connectivity AMP Connectors

    2,280
    RFQ
    3-822516-4

    Tabla de datos

    - Tape & Reel (TR) Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    1-1814655-5

    1-1814655-5

    CONN SOCKET SIP 20POS GOLD

    TE Connectivity AMP Connectors

    4,391
    RFQ
    1-1814655-5

    Tabla de datos

    - Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
    818-AG11D-ESL

    818-AG11D-ESL

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    3,697
    RFQ
    818-AG11D-ESL

    Tabla de datos

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
    4-1571551-2

    4-1571551-2

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    3,647
    RFQ
    4-1571551-2

    Tabla de datos

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    211-1-20-003

    211-1-20-003

    CONN IC DIP SOCKET 20POS GOLD

    CNC Tech

    216
    RFQ
    211-1-20-003

    Tabla de datos

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
    346-93-105-41-013000

    346-93-105-41-013000

    CONN SOCKET SIP 5POS GOLD

    Mill-Max Manufacturing Corp.

    261
    RFQ
    346-93-105-41-013000

    Tabla de datos

    346 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    820-AG11D-ESL-LF

    820-AG11D-ESL-LF

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    2,141
    RFQ
    820-AG11D-ESL-LF

    Tabla de datos

    800 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    2-1571552-6

    2-1571552-6

    820-AG11D-ESL-LF=800 DIP GF/SN

    TE Connectivity AMP Connectors

    1,260
    RFQ
    2-1571552-6

    Tabla de datos

    * Tube Active - - - - - - - - - - - - - - -
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