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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    121-83-652-41-001101

    121-83-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,139
    RFQ
    121-83-652-41-001101

    Tabla de datos

    121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-192-16-001101

    510-87-192-16-001101

    CONN SOCKET PGA 192POS GOLD

    Preci-Dip

    3,594
    RFQ
    510-87-192-16-001101

    Tabla de datos

    510 Bulk Active PGA 192 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-822-90T

    14-822-90T

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    3,552
    RFQ
    14-822-90T

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    612-83-964-41-001101

    612-83-964-41-001101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    4,979
    RFQ
    612-83-964-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-WGG

    ICA-314-WGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,236
    RFQ
    ICA-314-WGG

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-87-328-41-013101

    116-87-328-41-013101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,245
    RFQ
    116-87-328-41-013101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-428-41-013101

    116-87-428-41-013101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,520
    RFQ
    116-87-428-41-013101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-316-CGG

    ICO-316-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,865
    RFQ
    ICO-316-CGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-632-41-004101

    116-83-632-41-004101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,762
    RFQ
    116-83-632-41-004101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    16-3518-11H

    16-3518-11H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,217
    RFQ
    16-3518-11H

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    APA-316-T-P

    APA-316-T-P

    ADAPTER PLUG

    Samtec Inc.

    3,802
    RFQ
    APA-316-T-P

    Tabla de datos

    APA Bag Active - 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    20-0508-20

    20-0508-20

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    4,354
    RFQ
    20-0508-20

    Tabla de datos

    508 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    20-0508-30

    20-0508-30

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    2,365
    RFQ
    20-0508-30

    Tabla de datos

    508 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    20-1508-20

    20-1508-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,767
    RFQ
    20-1508-20

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    20-1508-30

    20-1508-30

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,739
    RFQ
    20-1508-30

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    126-93-304-41-001000

    126-93-304-41-001000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    4,391
    RFQ
    126-93-304-41-001000

    Tabla de datos

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-304-41-001000

    126-43-304-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,739
    RFQ
    126-43-304-41-001000

    Tabla de datos

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-648-41-007101

    116-83-648-41-007101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    4,524
    RFQ
    116-83-648-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-628-ZWTT-2

    ICA-628-ZWTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,402
    RFQ
    ICA-628-ZWTT-2

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    7-1437532-6

    7-1437532-6

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    4,439
    RFQ
    7-1437532-6

    Tabla de datos

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 350351352353354355356357...955Next»
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