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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    10-8270-310C

    10-8270-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,317
    RFQ
    10-8270-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8375-310C

    10-8375-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,961
    RFQ
    10-8375-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8575-310C

    10-8575-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,855
    RFQ
    10-8575-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8620-310C

    10-8620-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,388
    RFQ
    10-8620-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8630-310C

    10-8630-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,373
    RFQ
    10-8630-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APO-320-G-J

    APO-320-G-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,707
    RFQ
    APO-320-G-J

    Tabla de datos

    APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICO-316-ZNGT

    ICO-316-ZNGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,415
    RFQ
    ICO-316-ZNGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    510-87-176-16-001101

    510-87-176-16-001101

    CONN SOCKET PGA 176POS GOLD

    Preci-Dip

    2,952
    RFQ
    510-87-176-16-001101

    Tabla de datos

    510 Bulk Active PGA 176 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-176-16-071101

    510-87-176-16-071101

    CONN SOCKET PGA 176POS GOLD

    Preci-Dip

    2,515
    RFQ
    510-87-176-16-071101

    Tabla de datos

    510 Bulk Active PGA 176 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-181-14-031101

    510-87-181-14-031101

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    4,721
    RFQ
    510-87-181-14-031101

    Tabla de datos

    510 Bulk Active PGA 181 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    714-43-118-31-018000

    714-43-118-31-018000

    CONN SOCKET SIP 18POS GOLD

    Mill-Max Manufacturing Corp.

    2,056
    RFQ
    714-43-118-31-018000

    Tabla de datos

    714 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-87-648-41-011101

    116-87-648-41-011101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    3,120
    RFQ
    116-87-648-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-180-15-002101

    510-87-180-15-002101

    CONN SOCKET PGA 180POS GOLD

    Preci-Dip

    4,432
    RFQ
    510-87-180-15-002101

    Tabla de datos

    510 Bulk Active PGA 180 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-180-15-041101

    510-87-180-15-041101

    CONN SOCKET PGA 180POS GOLD

    Preci-Dip

    4,798
    RFQ
    510-87-180-15-041101

    Tabla de datos

    510 Bulk Active PGA 180 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-632-SST

    ICO-632-SST

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,693
    RFQ
    ICO-632-SST

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0210-T-11

    HLS-0210-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,072
    RFQ
    HLS-0210-T-11

    Tabla de datos

    HLS Tube Active SIP 20 (2 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    PGA175H009B5-1620R

    PGA175H009B5-1620R

    PGA SOCKET 175 CTS

    Amphenol ICC (FCI)

    2,283
    RFQ
    PGA175H009B5-1620R

    Tabla de datos

    - - Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
    299-43-316-10-001000

    299-43-316-10-001000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    3,199
    RFQ
    299-43-316-10-001000

    Tabla de datos

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-322-ZMGT

    ICO-322-ZMGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,144
    RFQ
    ICO-322-ZMGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-422-ZMGT

    ICO-422-ZMGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,124
    RFQ
    ICO-422-ZMGT

    Tabla de datos

    ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 335336337338339340341342...955Next»
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