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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    A-CCS068-Z-SM/T

    A-CCS068-Z-SM/T

    SOCKET

    Assmann WSW Components

    2,214
    RFQ
    A-CCS068-Z-SM/T

    Tabla de datos

    - Bulk Active PLCC 68 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
    AJ 64-LC

    AJ 64-LC

    SOCKET

    Assmann WSW Components

    3,064
    RFQ

    -

    - Bulk Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    ARO 64-HZL/NEC-T

    ARO 64-HZL/NEC-T

    SOCKET

    Assmann WSW Components

    2,994
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    AR24-HZL/7/07-TT

    AR24-HZL/7/07-TT

    CONN IC DIP SOCKET 24POS GOLD

    Assmann WSW Components

    3,217
    RFQ

    -

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A-ICS-254-08-TT50

    A-ICS-254-08-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    4,176
    RFQ
    A-ICS-254-08-TT50

    Tabla de datos

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    AR 32 HGL-TT

    AR 32 HGL-TT

    SOCKET

    Assmann WSW Components

    2,383
    RFQ

    -

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    A-CCS 028-Z-SM/T

    A-CCS 028-Z-SM/T

    IC SOCKET, CHIP CARRIER, 1.27MM,

    Assmann WSW Components

    2,014
    RFQ
    A-CCS 028-Z-SM/T

    Tabla de datos

    - Tape & Reel (TR) Active PLCC 28 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
    AR28-HZL/01-TT

    AR28-HZL/01-TT

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    2,344
    RFQ
    AR28-HZL/01-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    A-CCS84-Z-R

    A-CCS84-Z-R

    CONN SOCKET PLCC 84POS TIN

    Assmann WSW Components

    4,933
    RFQ
    A-CCS84-Z-R

    Tabla de datos

    - Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    A32-LCG-T-R

    A32-LCG-T-R

    CONN IC DIP SOCKET 32POS GOLD

    Assmann WSW Components

    2,036
    RFQ
    A32-LCG-T-R

    Tabla de datos

    - Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    Total 326 Record«Prev1... 2223242526272829...33Next»
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