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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    510-87-160-13-001101

    510-87-160-13-001101

    CONN SOCKET PGA 160POS GOLD

    Preci-Dip

    4,353
    RFQ
    510-87-160-13-001101

    Tabla de datos

    510 Bulk Active PGA 160 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-LGG

    ICO-314-LGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,365
    RFQ
    ICO-314-LGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    121-83-642-41-001101

    121-83-642-41-001101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,767
    RFQ
    121-83-642-41-001101

    Tabla de datos

    121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-632-F-I-TR

    ICF-632-F-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,738
    RFQ
    ICF-632-F-I-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    146-87-650-41-035101

    146-87-650-41-035101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    3,391
    RFQ
    146-87-650-41-035101

    Tabla de datos

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-650-41-036101

    146-87-650-41-036101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    3,741
    RFQ
    146-87-650-41-036101

    Tabla de datos

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-3513-11

    24-3513-11

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,533
    RFQ
    24-3513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-9513-10

    30-9513-10

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    4,444
    RFQ
    30-9513-10

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-318-SGG

    ICA-318-SGG

    CONN IC DIP SOCKET 18POS GOLD

    Samtec Inc.

    3,616
    RFQ
    ICA-318-SGG

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-SGG

    ICO-318-SGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,751
    RFQ
    ICO-318-SGG

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APA-320-T-A

    APA-320-T-A

    ADAPTER PLUG

    Samtec Inc.

    3,906
    RFQ
    APA-320-T-A

    Tabla de datos

    APA Bulk Active - 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-320-T-A

    APO-320-T-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,276
    RFQ
    APO-320-T-A

    Tabla de datos

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICA-324-ZWTT-2

    ICA-324-ZWTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,664
    RFQ
    ICA-324-ZWTT-2

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICA-624-ZWTT-2

    ICA-624-ZWTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,494
    RFQ
    ICA-624-ZWTT-2

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    799288-1

    799288-1

    CONN IC DIP SOCKET 16POS TINLEAD

    TE Connectivity AMP Connectors

    3,476
    RFQ
    799288-1

    Tabla de datos

    - Box Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 3.00µin (0.076µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin-Lead 5.00µin (0.127µm) Brass Thermoplastic, Polyester, Glass Filled -
    08-2501-21

    08-2501-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,900
    RFQ
    08-2501-21

    Tabla de datos

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    08-2501-31

    08-2501-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,069
    RFQ
    08-2501-31

    Tabla de datos

    501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-87-156-15-061101

    510-87-156-15-061101

    CONN SOCKET PGA 156POS GOLD

    Preci-Dip

    4,646
    RFQ
    510-87-156-15-061101

    Tabla de datos

    510 Bulk Active PGA 156 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-156-15-062101

    510-87-156-15-062101

    CONN SOCKET PGA 156POS GOLD

    Preci-Dip

    3,021
    RFQ
    510-87-156-15-062101

    Tabla de datos

    510 Bulk Active PGA 156 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-1406-T-H

    APH-1406-T-H

    APH-1406-T-H

    Samtec Inc.

    2,169
    RFQ

    -

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