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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    510-87-149-15-003101

    510-87-149-15-003101

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    2,919
    RFQ
    510-87-149-15-003101

    Tabla de datos

    510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-149-15-061101

    510-87-149-15-061101

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    4,055
    RFQ
    510-87-149-15-061101

    Tabla de datos

    510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-149-15-063101

    510-87-149-15-063101

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    3,516
    RFQ
    510-87-149-15-063101

    Tabla de datos

    510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-149-15-064101

    510-87-149-15-064101

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    3,416
    RFQ
    510-87-149-15-064101

    Tabla de datos

    510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-642-41-002101

    116-87-642-41-002101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,531
    RFQ
    116-87-642-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    714-43-113-31-018000

    714-43-113-31-018000

    CONN SOCKET SIP 13POS GOLD

    Mill-Max Manufacturing Corp.

    4,407
    RFQ
    714-43-113-31-018000

    Tabla de datos

    714 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-314-ZLGT

    ICO-314-ZLGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,440
    RFQ
    ICO-314-ZLGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    14-3518-11H

    14-3518-11H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,980
    RFQ
    14-3518-11H

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-1518-11

    32-1518-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,579
    RFQ
    32-1518-11

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-3513-10T

    38-3513-10T

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    3,957
    RFQ
    38-3513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-C195-11

    16-C195-11

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,045
    RFQ
    16-C195-11

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-C280-11

    16-C280-11

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,354
    RFQ
    16-C280-11

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-C212-10

    24-C212-10

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,637
    RFQ
    24-C212-10

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-C300-10

    24-C300-10

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,122
    RFQ
    24-C300-10

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-83-089-12-051101

    510-83-089-12-051101

    CONN SOCKET PGA 89POS GOLD

    Preci-Dip

    4,701
    RFQ
    510-83-089-12-051101

    Tabla de datos

    510 Bulk Active PGA 89 (12 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-089-13-082101

    510-83-089-13-082101

    CONN SOCKET PGA 89POS GOLD

    Preci-Dip

    3,136
    RFQ
    510-83-089-13-082101

    Tabla de datos

    510 Bulk Active PGA 89 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-318-SGT-L

    ICA-318-SGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,577
    RFQ
    ICA-318-SGT-L

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-642-41-012101

    116-83-642-41-012101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,478
    RFQ
    116-83-642-41-012101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-ZSGG

    ICA-314-ZSGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,657
    RFQ
    ICA-314-ZSGG

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-87-640-41-001101

    116-87-640-41-001101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    2,850
    RFQ
    116-87-640-41-001101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 288289290291292293294295...955Next»
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