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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    24-0513-10H

    24-0513-10H

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    4,340
    RFQ
    24-0513-10H

    Tabla de datos

    0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    19-0518-11H

    19-0518-11H

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    4,464
    RFQ
    19-0518-11H

    Tabla de datos

    518 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-1518-10H

    40-1518-10H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,299
    RFQ
    40-1518-10H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-6513-10H

    10-6513-10H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,754
    RFQ
    10-6513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-0518-00

    17-0518-00

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,937
    RFQ
    17-0518-00

    Tabla de datos

    518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-1518-10T

    32-1518-10T

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,421
    RFQ
    32-1518-10T

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6518-11

    28-6518-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,003
    RFQ
    28-6518-11

    Tabla de datos

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-3501-20

    14-3501-20

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    3,279
    RFQ
    14-3501-20

    Tabla de datos

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3501-30

    14-3501-30

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    3,423
    RFQ
    14-3501-30

    Tabla de datos

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    02-7250-10

    02-7250-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    2,275
    RFQ
    02-7250-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 4131 Record«Prev1... 7879808182838485...414Next»
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