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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    14-3518-10H

    14-3518-10H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,630
    RFQ
    14-3518-10H

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-9513-10T

    20-9513-10T

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,840
    RFQ
    20-9513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    26-3513-10T

    26-3513-10T

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    2,309
    RFQ
    26-3513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    05-0503-31

    05-0503-31

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    4,027
    RFQ
    05-0503-31

    Tabla de datos

    0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    12-3513-10H

    12-3513-10H

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    2,015
    RFQ
    12-3513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    C9116-00

    C9116-00

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,817
    RFQ
    C9116-00

    Tabla de datos

    Edge-Grip™, C91 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    26-0518-10T

    26-0518-10T

    CONN SOCKET SIP 26POS GOLD

    Aries Electronics

    2,945
    RFQ
    26-0518-10T

    Tabla de datos

    518 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    26-1518-10T

    26-1518-10T

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    4,807
    RFQ
    26-1518-10T

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    36-1518-10T

    36-1518-10T

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,749
    RFQ
    36-1518-10T

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    39-0518-10

    39-0518-10

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    2,542
    RFQ
    39-0518-10

    Tabla de datos

    518 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 4131 Record«Prev1... 6263646566676869...414Next»
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