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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD0

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Aries Electronics
    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    32-3503-31

    32-3503-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,686
    RFQ
    32-3503-31

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    35-0508-21

    35-0508-21

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    4,061
    RFQ
    35-0508-21

    Tabla de datos

    508 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    35-0508-31

    35-0508-31

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    4,249
    RFQ
    35-0508-31

    Tabla de datos

    508 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    24-3508-312

    24-3508-312

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,636
    RFQ
    24-3508-312

    Tabla de datos

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    31-0511-11

    31-0511-11

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    2,150
    RFQ
    31-0511-11

    Tabla de datos

    511 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    36-3551-11

    36-3551-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    3,930
    RFQ
    36-3551-11

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    38-0501-21

    38-0501-21

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    4,005
    RFQ
    38-0501-21

    Tabla de datos

    501 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    38-0501-31

    38-0501-31

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    4,740
    RFQ
    38-0501-31

    Tabla de datos

    501 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    60-9503-20

    60-9503-20

    CONN IC DIP SOCKET 60POS GOLD

    Aries Electronics

    2,763
    RFQ
    60-9503-20

    Tabla de datos

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    60-9503-30

    60-9503-30

    CONN IC DIP SOCKET 60POS GOLD

    Aries Electronics

    4,923
    RFQ
    60-9503-30

    Tabla de datos

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 4131 Record«Prev1... 326327328329330331332333...414Next»
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