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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD0

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Aries Electronics
    全部重置
    应用所有
    结果: 4131
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    40-6572-10

    40-6572-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    2,413
    RFQ
    40-6572-10

    Tabla de datos

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    22-4503-21

    22-4503-21

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,618
    RFQ
    22-4503-21

    Tabla de datos

    503 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-0508-21

    24-0508-21

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    3,232
    RFQ
    24-0508-21

    Tabla de datos

    508 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    24-1508-21

    24-1508-21

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,306
    RFQ
    24-1508-21

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    34-81150-610C

    34-81150-610C

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    3,259
    RFQ
    34-81150-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    34-81250-610C

    34-81250-610C

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    2,788
    RFQ
    34-81250-610C

    Tabla de datos

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-0508-21

    28-0508-21

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    4,189
    RFQ
    28-0508-21

    Tabla de datos

    508 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    28-0508-31

    28-0508-31

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    3,203
    RFQ
    28-0508-31

    Tabla de datos

    508 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    28-1508-21

    28-1508-21

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,450
    RFQ
    28-1508-21

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    28-1508-31

    28-1508-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,638
    RFQ
    28-1508-31

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    Total 4131 Record«Prev1... 300301302303304305306307...414Next»
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