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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    24-6552-10

    24-6552-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    0
    RFQ
    24-6552-10

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6553-10

    24-6553-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    0
    RFQ
    24-6553-10

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3554-10

    24-3554-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    0
    RFQ
    24-3554-10

    Tabla de datos

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3503-20

    32-3503-20

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    0
    RFQ
    32-3503-20

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-3503-30

    32-3503-30

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    0
    RFQ
    32-3503-30

    Tabla de datos

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-820-90C

    32-820-90C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    0
    RFQ
    32-820-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    80-PGM12015-10

    80-PGM12015-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    RFQ
    80-PGM12015-10

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    23-7400-10

    23-7400-10

    CONN SOCKET SIP 23POS TIN

    Aries Electronics

    0
    RFQ
    23-7400-10

    Tabla de datos

    700 Elevator Strip-Line™ Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    81-PGM09001-10

    81-PGM09001-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    RFQ
    81-PGM09001-10

    Tabla de datos

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-6823-90

    18-6823-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    0
    RFQ
    18-6823-90

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    Total 4131 Record«Prev1... 233234235236237238239240...414Next»
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