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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    68-PGM10006-10

    68-PGM10006-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    RFQ

    -

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-4823-90C

    16-4823-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-4823-90C

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    34-0508-20

    34-0508-20

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    0
    RFQ
    34-0508-20

    Tabla de datos

    508 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    34-0508-30

    34-0508-30

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    0
    RFQ
    34-0508-30

    Tabla de datos

    508 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    34-1508-20

    34-1508-20

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    0
    RFQ
    34-1508-20

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    34-1508-30

    34-1508-30

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    0
    RFQ
    34-1508-30

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    16-6503-21

    16-6503-21

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-6503-21

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-6503-31

    16-6503-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-6503-31

    Tabla de datos

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    18-0503-21

    18-0503-21

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    0
    RFQ
    18-0503-21

    Tabla de datos

    0503 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    18-0503-31

    18-0503-31

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    0
    RFQ
    18-0503-31

    Tabla de datos

    0503 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    Total 4131 Record«Prev1... 226227228229230231232233...414Next»
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